2CL77
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL75
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL01-12
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL04-12
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL2FM
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL2FL
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL70A
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
HV-6X2P1
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL03-15T
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL08-08T
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL08-10T
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL08-10C
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL03-15C
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL03-18C
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
UX-F8D
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL75A
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL74
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL73
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL72
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL71A
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL18KV/20mA
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL20KV/20mA
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL01-09
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL04-15
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
CL01-12D
Using the world's latest high-voltage rectifiers level design process, its basic features are the number of mesa-type silicon chips stacked together, in order to achieve a layered cell structure of high pressure, using a unique new PN junction passiva...
2CL(30-450)KV/0.05A
Type Peak reverse repetitive voltage VRRM Forward average rectifier current If(AV) Max forward voltage Vfm Max forward surge current Ifsm Normal temperature leakage current Irrm Time of reverse recovery trr Dimension Type KV A V A μA...
2CL(20-300)KV/0.1A
Type Peak reverse repetitive voltage VRRM Forward average rectifier current If(AV) Max forward voltage Vfm Max forward surge current Ifsm Normal temperature leakage current Irrm Time of reverse recovery trr Dimension Type KV A ...
2CL(10-300)KV/1.0A
Type Peak reverse repetitive voltage VRRM Forward average rectifier current If(AV) Max forward voltage Vfm Max forward surge current Ifsm Normal temperature leakage current Irrm Time of reverse recovery trr Dimension Type KV A ...
2CL(8-250)KV/5.0A
Type Peak reverse repetitive voltage VRRM Forward average rectifier current If(AV) Max forward voltage Vfm Max forward surge current Ifsm Normal temperature leakage current Irrm Time of reverse recovery trr Dimension Type KV A ...
2CL(5-150)KV/15.0A
Type Peak reverse repetitive voltage VRRM Forward average rectifier current If(AV) Max forward voltage Vfm Max forward surge current Ifsm Normal temperature leakage current Irrm Time of reverse recovery trr Dimension Type KV A V...