1/3ページ
カタログの表紙
カタログの表紙

このカタログをダウンロードして
すべてを見る

ダウンロード(463.4Kb)

COM Express Compact Type 6: conga-TCR8 データシート

製品カタログ

AMD Ryzen Embedded 8000 プロセッサー搭載 COM Express Compact Type 6 モジュール

【conga-TCR8】は、AMD Ryzen Embedded 8000 プロセッサーシリーズを搭載した COM Express Compact Type 6 モジュールです。プロセッサーは4種類(6 または 8コア)から選択でき、最大 8個の Zen 4 コアと、AMD Radeon RDNA 3 グラフィックス、AMD XDNA NPUを内蔵し、2つの SO-DIMM ソケットにより最大 128GB のDDR5 RAM(最高 5600 MT/s 、ECCはオプション)を実装することができ、オプションでオンボード NVMe SSD を搭載可能です。TDPは 15~54W とスケーラブルで既存製品のアップグレードにも適しています。AI推論向けに最大で 39TOPSの性能を提供し、最新のAIとグラフィックスを組み合わせた、高いコンピューティングパワーを必要とする大量生産で価格に厳しい、エッジにおける AIアプリケーションに最適です。適用分野はメディカルイメージングや試験&計測、AIを使ったPOS、ハイエンドのゲーミングなどです。

このカタログについて

ドキュメント名 COM Express Compact Type 6: conga-TCR8 データシート
ドキュメント種別 製品カタログ
ファイルサイズ 463.4Kb
登録カテゴリ
取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

この企業の関連カタログ

この企業の関連カタログの表紙
SMARC: conga-SMX95 データシート
製品カタログ

コンガテックジャパン株式会社

この企業の関連カタログの表紙
【製品ハイライト】 コンガテック ハイライト2024
製品カタログ

コンガテックジャパン株式会社

この企業の関連カタログの表紙
COM Express Compact Type 6 モジュール: conga-TC700 データシート
製品カタログ

コンガテックジャパン株式会社

このカタログの内容

Page1

Folie 1

conga-TCR8 Up to 8 Zen 4 cores AMD Radeon™ RDNA™ 3 Graphics AMD XDNA™ NPU Up to 128 GB RAM (optional with ECC) TDP Range from 15W to 54W Onboard NVMe™ SSD (option) Form Factor COM Express® Compact | Type 6 connector pinout CPU Processor Cores / Base Frequency TDP NPU Graphics Threads / max. Turbo AMD Ryzen™ Embedded 8845HS 8C / 16T 3.8GHz / 5.1GHz 35-54W 16 TOPs 6 WGPs AMD Ryzen™ Embedded 8840U 8C / 16T 3.3GHz / 5.1GHz 15-30W 16 TOPs 6 WGPs AMD Ryzen™ Embedded 8645HS 6C / 12T 4.3GHz / 5.0GHz 35-54W 16 TOPs 4 WGPs AMD Ryzen™ Embedded 8640U 6C / 12T 3.5GHz / 4.9GHz 15-30W 16 TOPs 4 WGPs DRAM 2 SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) | up to 5600 MT/s | ECC (option) Mass Storage NVMe™ SSD up to 1 TB capacity (option instead of SATA ports) Graphics Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs) AI Acceleration Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance Display Up to 3x DDI | LVDS or eDP | 4x independent displays Ethernet 2.5 GbE via Intel® i226 Ethernet controller series I/O Interfaces 4x USB 3.2 Gen2 | 4x USB 2.0 | 2x SATA 6Gb/s (if NVMe™ SSD option is not used) | 6x PCIe Gen4 (8 lanes) | PEG x8 Gen4 | 1x I²C Bus | 1x GPSPI | 2x UART | 8x GPIO | 1x SMBus | 1x LPC Audio HD-Audio over DDI ports | HDA interface congatec Board controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) | AMD Security Processor | AMD Memory Guard Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux Hypervisor RTS Real-Time Hypervisor Temperature Embedded Temp.: Operating 0°C to 60°C Storage -20°C to 80°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com
Page2

Folie 2: conga-TCR8 | Block Diagram

conga-TCR8 SO-DIMM 0 SO-DIMM 1 AMD Ryzen™ Embedded 8000 LPC “Zen4 4nm” Bridge congatec Board Controller COM Express Type 6 Connectors (Rev. 3.1) conga-TCR8 www.congatec.com DDI1 DDI2 DDI3 eDP to LVDS LVDS / eDP Bridge eDP opt. PEG 0-7 Gen 4 x8 or 2x4 PCIe 0-3 Gen 4 4x1 or 2x2 or 1x4 PCIe 4-7 Gen 4 2x2 or 1x4 SATA 0-1 SATA Controller NVMe opt. GbE I226 GbE USB3.2 P0 USB3.2 P1 USB3.2 P2 USB HUB 10Gb USB3.2 P3 4x USB2.0 HDA SPI TPM BIOS LPC GPIO GP_SPI SMBus I2C UART 0-1 MGMT / FAN
Page3

Folie 3

conga-TCR8 | Order Information Article PN Description conga-TCR8/8845HS 051700 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. conga-TCR8/8840U 051701 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. conga-TCR8/8645HS 051702 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. conga-TCR8/8640U 051703 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. conga-TCR8/CSA-HP-B 051750 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. conga-TCR8/CSA-HP-T 051751 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. conga-TCR8/CSP-HP-B 051752 Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCR8/CSP-HP-T 051753 Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TCR8/HSP-HP-B 051754 Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCR8/HSP-HP-T 051755 Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.1 065821 Evaluation carrier board for COM Express Type 6 revision 3.1 modules. DDR5-SODIMM-5600 (8GB) 68930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (16GB) 68931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (32GB) 68932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (48GB) 68933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (64GB) 68934 DDR5 SODIMM memory module with up to 5600 MT/s and 64GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (8GB) 68940 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (16GB) 68941 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (32GB) 68942 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (48GB) 68943 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (64GB) 68944 DDR5 SODIMM memory module with up to 5600 MT/s and 64GB RAM with ECC, commercial temp 0°C to +60°C © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.3 – September 10th, 2024 www.congatec.com