COM Express Type 6 評価ボード: conga-TEVAL3/COMe3.1 データシート

COM Express Type 6 Rev. 3.1 Evaluation Carrier Board conga-TEVAL3/COMe 3.1 Evaluation Carrier for COMe Type 6 modules Supports COMe Compact and Basic modules using connector Pinout Type 6 Compliant to latest COMe Spec Rev. 3.1 Board Type Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1 Internal IO PCIe Gen4 x16 (PEG) PCIe Gen4 x4 2x PCIe Gen4 x1 M.2 Key B 2242/3042 (USB2.0 muxed, PCIe x1, SIM) M.2 Key E 2230 (USB2.0 muxed, PCIe x1) Dual USB2.0 header (muxed) USB Typ B (muxed) 3x SATA 6Gb/s SATA 6Gb/s with SATADOM Pin 7 LVDS (muxed with eDP) eDP (muxed with LVDS) VGA Dsub HDA/SoundWire header GSPI header SD Card socket (muxed with GPIOs) SPI boot flash socket Up to 4x COM headers CAN header LPC header Feature Connector ATX-4pin Power connector ATX-24pin Power connector Banana sockets for single power input External IO RJ45 2.5G Base-T 2x Dual USB Type A up to 10Gbps 2x USB4 Type C up to 20Gbps DP++ HBR3 2x Audio Jack 3.5mm Temperature Range Operation -40°C to 85°C | Storage -40°C to 85°C Humidity Operation 10% to 90% r. H. non cond. | Storage 5% to 95% r. H. non cond. Size 294 x 244 mm Article conga-TEVAL3/COMe 3.1 PN 065820 © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.1 – April 4th 2024 www.congatec.com