SMARC: conga-STDA4 データシート

conga-STDA4 - SMARC Module based on TI TDA4VM application processor and DRA829J Arm® networking processor - Heterogenous architecture with dual Arm® Cortex®-A72, DSP and accelerators for deep learning and multimedia - Arm® Cortex®-R5F MCUs to offload real-time communication - Highest reliability for harsh environment applications - Industrial temperature range -40°C to +85°C Form factor SMARC Module Specification 2.1 SoC TI TDA4VM and DRA829J Arm® Application and Networking Processors Arm Cortex-A72 ARM Cortex-R5F DSP Cores MMA GPU TDA4VM88 2x @ 2.0 GHz 6x @ 1.0 GHz 1x C7x up to 80 GFLOPs & Deep Learning 3D PowerVR DRA829JM 2x @ 2.0 GHz 6x @ 1.0 GHz 2x C66 up to 40 GFLOPs Up to 8 TOPS Rogue 8XE GE8430 DRAM Up to 8 GB onboard LPDDR4x memory | 3733 MT/s | inline ECC | 8 MB of on-chip L3 RAM with ECC and coherency | 512KB on- chip SRAM in MAIN domain, protected by ECC Ethernet 2x Gbit Ethernet with IEEE 1588 support I/O Interfaces 1x dual-role USB 2.0 | 2x USB 2.0 | 2x USB 3.0 | 1x SDIO 3.0 | 2x PCIe 3.0 x1 + 1x PCIe 3.0 x2 or up to 4x PCIe 3.0 x1 | 2x I²C | 2x SPI | 4x UART (2x with Handshake) | 2x CAN FD | 14x GPIO | optional full industrial onboard Ublox WiFi/BT module Mass Storage eMMC 5.1 up to 128 GB optional pseudo-SLC Sound 2x I²S Graphics Integrated in SoC | Graphics Accelerator 3D GPU PowerVR Rogue 8XE GE8430 | up to 1x Ultra-HD or 4x Full-HD 60fps display resolution | Up to 4 concurrent displays | VPU up to 4k60p H.264/H.265 decode / 1080p60 H.264 encode | OpenGL ES 3.1 | OpenVX | OpenCL Video Interfaces 1x dual channel 24-bit LVDS | 1x Display Port 1.4 supports up to 4 1080p60 displays via MST | optional 1x MIPI-DSI 4-lane shared with LVDS | 2x MIPI-CSI | up to 2x integrated Image Signal Processor (ISP) for MIPI-CSI camera on TDV4VM Features Watchdog Timer | Console Port | High Precision Real Time Clock AI & Deep Learning Deep-learning Matrix Multiply Accelerator Accelerators (MMA) with up to 8 TOPS (8b) | C7x floating point, vector DSP with up to 80 GFLOPs | Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators | Depth and Motion Processing Accelerators (DMPAC) Security Customer programmable root key, up to RSA-4K or ECC-512 | Crypto hardware accelerators, PKA with ECC, AES, SHA, RNG, DES and 3DES | Secure boot with secure runtime support | SHE, Encryption Engine AES-128, AES-256, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 and secure key storage Boot Loader U-Boot boot loader Operating Systems Linux | QNX | RTOS Power Consumption Typ. application 5-10W @ 5V Temperature Range Operating Temperature Range: -40 to +85°C industrial grade Storage Temperature Range: -40 to +85°C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 82 x 50 mm (3,23” x 1,97”) www.congatec.com

conga-STDA4 | Block Diagram SMARC Connector Onboard DSI to LVDS LPDDR4 LPDDR4 MIPI-DSI 2-channel LVDS Bridge Memory MIPI-DSI 4-lane * DP 1.4 DP PHY GBE0 Ethernet 0 GBE1 PHY Ethernet 1 PCIe PCIe Gen 3 COM Driver Console / UART PCIe PCIe Gen 3 PCIe PCIe Gen 3 PCIe PCIe Gen 3 eMMC eMMC 5.1 MIPI-CSI 1 MIPI-CSI 4-lane TI TDA4VM / DRA829J Precision RTC I2C MIPI-CSI 0 MIPI-CSI 2-lane Arm® Application and 4L CSI FFC * Networking Processors SDIO SDIO I2S 2x I2S Audio 1x USB 2.0 dual-role USB 2.0 SDIO 2x USB 3.0 / 2.0 USB 3.0 USB Hub 2x USB 2.0 CAN FD 2x CAN FD SDIO Ublox 2x UART 4-wire UART WiFi/ I2S UART 2x UART 2-wire BT* UART I2C 2x I2C SPI 2x SPI GPIO GPIO [0:13] Power Rail Power PMIC Control * Assembly Option www.congatec.com

conga-STDA4 | Order Information Article PN Description SMARC Module based on high-performance industrial TI TDA4VM Arm® Application conga-STDA4/i-TDA4VM-4G eMMC32 051510 processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. SMARC Module based on high-performance industrial TI TDA4VM Arm® Application conga-STDA4/i-TDA4VM-2G eMMC32 051511 processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. SMARC Module based on high-performance industrial TI DRA829J Arm® Networking conga-STDA4/i-DRA829J-4G eMMC32 051512 processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C. SMARC Module based on high-performance industrial TI DRA829J Arm® Networking conga-STDA4/i-DRA829J-2G eMMC32 051513 processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C SMARC Module based on high-performance industrial TI TDA4VM Arm® Application conga-STDA4/i-TDA4VM-2G eMMC32 processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA MAYA-W160 051520 (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Features Ublox Wifi/BT module MAYA-W260. Industrial grade temperature range from -40°C to 85°C. conga-STDA4/CSP-B 051550 Passive cooling solution for SMARC Module conga-STDA4 based on TI TDA4VM and DRA829J Arm® processors. All standoffs are with 2.7 mm bore hole. conga-STDA4/HSP-B 051551 Standard heatspreader for SMARC Module conga-STDA4 based on TI TDA4VM and DRA829J Arm® processors. All standoffs are with 2.7 mm bore hole. SMARC/CSA Adapter 050060 Active cooling solution adapter for SMARC modules used in combination with module heat spreader. conga-SEVAL 007010 Evaluation carrier board for SMARC modules. conga-SMC1/SMARC-ARM 020750 3.5’’ carrier board for congatec SMARC modules based on ARM architecture. © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is carefully All rights reserved. checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Draft Rev. 0.4, January 10, 2023 www.congatec.com