COM Express Compact Type 6: conga-TC370 データシート

conga-TC370 - 8th Generation Intel® Core™ SOC processor up to 4 cores - Configuration of display mode by software (LVDS/eDP) - Low power consumption (TDP 15W, cTDP 10W) - Up to 64 GByte dual channel DDR4 2400 MT/s - Optional eMMC 5.1 on board mass storage - Trusted Platform Module (TPM 2.0) - COM Express Compact Type 6 module 95x95 mm² Formfactor COM Express® Rev. 3.0, Compact Formfactor (95 x 95 mm), Type 6 Connector Pinout CPU Intel® Core™ i7-8665UE 4 Cores | 8 Threads 1.7 GHz | 4.4 GHz (boost) 8 MB cache 15-25 W cTDP Intel® Core™ i5-8365UE 4 Cores | 8 Threads 1.6 GHz | 4.1 GHz (boost) 6 MB cache 15-25 W cTDP Intel® Core™ i3-8145UE 2 Cores | 4 Threads 2.2 GHz | 3.9 GHz (boost) 4 MB cache 15-25 W cTDP Intel® Celeron™ 4305UE 2 Cores | 2 Threads 2.0 GHz 2 MB cache 15 W TDP DRAM Dual channel DDR4 up to 2400 MT/s | 2x SO-DIMM | up to 2x 32 GByte Chipset Integrated in SoC Ethernet Intel® i219-LM/V GbE LAN controller with AMT 12.0 support I/O Interfaces 8x PCI Express™ Gen 3.0 lanes | 3x SATA Gen 3 | 4x USB 3.1 Gen 2 @ 10 Gbit/s | 8x USB 2.0 | LPC bus | I²C bus (fast mode, 400 kHz, multi-master) | 2x UART Sound Digital High Definition Audio Interface with support for multiple audio codecs Graphics Intel® Gen9 HD Graphics Engine with OpenCL 2.1, OpenGL 4.5 and DirectX 11/12 | up to three independent displays: HDMI 2.0a / DisplayPort 1.2 / eDP 1.4 / (VGA optional) | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding Storage optional eMMC 5.1 on board mass storage congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Features AMI Aptio® UEFI 2.x firmware | 32 MByte serial SPI firmware flash Security TPM 2.0 Infineon SLB9665 Power Management ACPI compliant with battery support | Suspend to RAM (S3) support | S5 enhanced support | Intel AMT 12.0 support Operating Systems Microsoft® Windows 10 (64bit only) | Microsoft® Windows 10 IoT Enterprise (64bit only) | Linux Power Consumption See user’s guide for full details Temperature Operating: 0 to +60°C Storage: -40 to +85°C Extended Temperature Screening service on request: -25 to +80°C (burn-in & cold-soak) -40 to +85°C (burn-in & cold-soak) Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 95 mm (3.74” x 3.74”) 1 www.congatec.com

conga-TC370 | Block diagram 2 www.congatec.com

conga-TC370 | Order Information Article PN Description conga-TC370/i7-8665UE 048800 COM Express Type 6 Compact module based on Intel® Core™ i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake). conga-TC370/i5-8365UE 048801 COM Express Type 6 Compact module based on Intel® Core™ i5-8365UE 4-core processor with 1.6GHz up to 4.1GHz turbo boost, 6MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake). conga-TC370/i3-8145UE 048802 COM Express Type 6 Compact module based on Intel® Core™ i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake). conga-TC370/4305UE 048804 COM Express Type 6 Compact module based on Intel® Celeron™ 4305UE 2-core processor with 2.0GHz, 2MB L2 cache, Intel® UHD Graphics 610 and dual channel DDR4 2133 MT/s memory interface (formerly Whiskey Lake). conga-TC370/CSA-HP-B 048850 Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. conga-TC370/CSA-HP-T 048851 Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. conga-TC370/CSP-HP-B 048852 Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. conga-TC370/CSP-HP-T 048853 Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Threaded mounting with threaded standoffs M2.5. conga-TC370/HSP-HP-B 048854 Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. conga-TC370/HSP-HP-T 048855 Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. DDR4-SODIMM-2400 (4GB) 068790 DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM DDR4-SODIMM-2400 (8GB) 068791 DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM DDR4-SODIMM-2400 (16GB) 068792 DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM DDR4-SODIMM-2666 (32GB) 068806 DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM conga-TEVAL 065810 Evaluation carrier board for Type 6 COM-Express-modules © 2022 congatec GmbH. All rights All data is for information purposes only. Although all the information contained within this document is reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Rev. January 2022 AB 3 www.congatec.com