NEPCON Japan 2017 出展製品【ニッケルめっき添加剤・光沢硫酸すずめっき液】

Page 1:NEPCON Japan 2017E x h i b i t e d p r o d u c t2017.1.18 - 1.20出 展 製 品տ 3 6 0 - 0 8 4 4 㛊 桪 源 擓 靼 䋐 䖴 环 㪬٠⾱ 8 2 3 - 5T E L . 0 4 8 - 5 3 3 -2 4 0 6ㅷ颵⥂鏾鿇Ӎտ 3 31 - 0 8 11 㛊 桪 源 ְׁ‫׋‬‫ת‬ 䋐 ⻌ ⼒ し ꅿ 歕 2 - 3 -1T E L . 0 4 8 - 6 6 5 -2 0 0 5䪮遭Ꟛ涪鿇Ӎտ10 3 - 8 4 0 3 匌 ❨ 鿪 ⚥ 㣛 ⼒ 傈 劤 堀 劤 歕 4 - 8 -2 ؎ٙ‫ؗ‬‫ؽ‬ ٕT E L . 0 3 - 3 2 7 9 - 0 6 7 1劤 爡ӍMeltex AsiaPacific Co., Ltd.938 Soi Sukhumvit 101 (Punnawithi 28), Sukhumvit Road, Bangchak, Prakanong, Bangkok 10260, Thailand.TEL.66 -2331-9905MeltexKorea Co., Ltd.Gunpo IT VALLEY B -1905- 6, Gosan-ro 148beon-gil 17, Gunpo -si, Gyeonggi- do 435-833, Korea.TEL.82-31-8086 -7170㌀噟Ꟛ涪‫ؚٕ‬٦‫ف‬ տ 3 31 - 0 8 11 㛊 桪 源 ְׁ‫׋‬‫ת‬ 䋐 ⻌ ⼒ し ꅿ 歕 2 -2 - 4 C S ‫إ‬ٝ ‫ة‬٦3 FT E L . 0 4 8 - 6 6 5 -2 12 2銮傈劤㌀噟‫ؚٕ‬٦‫ف‬㉀ㅷ㌀噟‫ؚٕ‬٦‫ف‬ տ 3 31 - 0 8 11 㛊 桪 源 ְׁ‫׋‬‫ת‬ 䋐 ⻌ ⼒ し ꅿ 歕 2 -2 - 4 C S ‫إ‬ٝ ‫ة‬٦3 FT E L . 0 4 8 - 6 6 5 -2 10 7⚥ 鿇 ؒ ٔ ، տ4 6 0 - 0 0 0 2 䠥 濼 源 せ 〢 㾊 䋐 ⚥ ⼒ ⚵ ‫ך‬ ⰻ 2 -2 -2 3 ؎ٙ‫ؗ‬‫ؽ‬ ٕ 4 FT E L . 0 5 2 -2 11 - 6 2 74匌 ⻌ ؒ ٔ ، տ 9 8 0 - 0 8 11 㹧 㙹 源 ➱ 〴 䋐 ꫬ 衝 ⼒♧ 殢 歕 1 -2 -2 5 ➱ 〴 N S ‫ؽ‬ ٕ 8 FT E L . 0 2 2 - 7 9 6 - 6 6 9 5ꟼ 銮 ؒ ٔ ، տ5 41 - 0 0 5 7 㣐 ꢻ 䏍 㣐 ꢻ 䋐 ⚥ 㣛 ⼒ ⻌ ⛉ 㹇 㼇 歕 1 - 4 -15 S C 㜮 瘡 劤 歕 ‫ؽ‬ ٕ 9 FT E L . 0 6 - 6 2 6 6 -15 3 5⛯ 䊜 ؒ ٔ ، տ8 12 - 0 0 0 7 状 䀤 源 状 䀤 䋐 ⽆ 㢳 ⼒ 匌 嫰 䜋 2 -2 0 -2 7 ؎ٙ‫ؗ‬‫ؽ‬ ٕ2 FT E L . 0 9 2 - 4 7 2 -2 8 61匌傈劤㌀噟‫ؚٕ‬٦‫ف‬ꟼ匌٥歌⥋馉ؒٔ،& 4 ( ‫ث‬ ٦‫ي‬ տ 3 31 - 0 8 11 㛊 桪 源 ְׁ‫׋‬‫ת‬ 䋐 ⻌ ⼒ し ꅿ 歕 2 -2 - 4 C S ‫إ‬ٝ ‫ة‬٦3 FT E L . 0 4 8 - 6 6 5 -2 10 71 8 #‫ث‬ ٦‫ي‬ տ 3 31 - 0 8 11 㛊 桪 源 ְׁ‫׋‬‫ת‬ 䋐 ⻌ ⼒ し ꅿ 歕 2 -2 - 4 C S ‫إ‬ٝ ‫ة‬٦3 FT E L . 0 4 8 - 6 6 5 -2 10 7MeltexTaiwan Inc.25F-1, No.11, Section 2, Huan-nan Road, Ping- Cheng District, Taoyuan City, Taiwan, R.O.C.TEL.886 -3-4020500Meltex(HK)Ltd. Unit D, 8/F., Chinabest International Centre, 8 Kwai On Road, Kwai Chung, N.T., Hong Kong.TEL.852-2420 -8938Meltex(Tianjin)Ltd. E3, 306 XEDA Sci-Tech Park, Xiqing Economic and Technological Development Area, Tianjin 300385, China.TEL.86 -22-2347-1617Meltex(Tianjin)Ltd.Shenzhen Branch20/F, Guomaoshang ye Building, Nanhu Road, Luohu District, Shenzhen, China.TEL.86 -755-8230 - 0121㌀ 噟 䬐 䔲Ӎ擓 靼 䊨 㜥 տ360 - 0844 㛊桪源擓靼䋐䖴环㪬٠⾱823-5TEL.048-533-4600MeltexAsia(Thailand)Co., Ltd.Amata Nakorn Industrial Estate Phase 8, 700/831 Moo.6, Tambol Nongtumlueng, Amphur Phanthong, Chonburi 20160, Thailand.TEL.66-38-185-545匌嵲ًٕ‫أؙحذ‬吳䒭⠓爡 տ510 - 0875 ♲ꅾ源㔊傈䋐䋐㣐屚歊3-4-45TEL.0593-45-4468匌❨⻉䊨堣吳䒭⠓爡 տ399-4601 ꞿꅿ源♳⟻齡龾皹鰵歕㣐㶵⚥皹鰵14017-50 ⽂⾱䊨噟㔚㖑TEL.0265-79-8041欰 欵 䬿 挿Ӎh t t p : / / w w w . m e l t e x . c o m /

Page 2:SN-2680Series2Ⳣ椚搀‫׃‬ Meldip 1200Ⳣ椚SN-2680⡚涪岘➬圫 Low-foaming type‫ٗؿ‬٦‫ٕأ‬٦‫ٖف‬٦‫ة‬٦㼎䘔〳 Suitable for use with flow through plater⚥䚍pH5.0։8.0Neutral‫ֹ׏׭‬⠼‫ן‬䫇ⵖ➬圫 Supressed plating growthꨇ稆勞‫ֹ׏׭ך‬⠼‫ן‬䫇ⵖ Effective suppression even on difficult to plate materials⚥䚍pH5.0։8.0NeutralSN-2680 BF-1ꨵ噰顦➰ֹ䫇ⵖ➬圫 Low coupling typeꤣ噰ꨵ噰鿇‫فحثךפ‬顦➰ֹ䫇ⵖ Low coupling on chip electrodes䓲ꃐ䚍pH5.2։5.7Weakly acidicSN-2700䓲ꃐ䚍➬圫 Weakly acidic type⡚慬䏝Sn:14g/LLow tin concentration䓲ꃐ䚍pH3.5։4.5Weakly acidic‫ֹ׏׭ٕ؛حص‬幐⸇⶝ Sulfamate nickel plating solutionMelbright NI-2226Ӫ⚥䚍嵭‫׭׋ך‬ծ‫أؙحىٓإ‬稆勞‫װ‬⡚輐挿‫أٓؖ‬‫ו׿הק׾‬嵴굸‫ָֹ׏׭ח׆ׇ‬〳腉խNeutral pH will not corrode ceramics or glass substratesӪ‫ךֹ׏׭‬⠼‫׾ן‬䫇ⵖծַ‫א‬䓲ְ㖇簭䘔⸂‫ֹ׏׭ך‬淼芘ָ䖤‫׷׸׵‬խDeposit overgrowth is suppressed and provides low internal stress deposits鋵宏⻉Ⳣ椚⶝ Hydrophilic treatment agentsMeldip 1200Ӫ0603‫ך♴⟃ؤ؎؟‬ꨵ㶨鿇ㅷ‫ך‬嵤麇‫׾‬꣇姺խPrevents chips sized 0603 and below from floatingӪ‫ֹ׏׭ٕ؛حص‬嵭‫ךפ‬幉Ⰵ‫ח‬㼎‫׃‬ծ崞䚍挥‫׹‬麓‫ד‬ꤐ⿠խCan be extracted from nickel plating bath by means of activated carbon treatment‫ֹ׏׭׆ׅ‬巉 Tin plating solutionMelplate SN Series䗍稢⻉٥㢳ꨵ噰⻉٥‫ز؎ٓؑؿ‬禸稆勞‫וז‬ծ圫ղ‫صז‬٦‫ֶחؤ‬䘔ִ‫׷ׅ‬ ‫فحث‬鿇ㅷ欽‫أإٗف‬Chemical process for electronic components manufacturing : miniature chips, multiple electrode chips, ferrite materials etcֶ㹏圫‫صך‬٦‫׵ַؤ‬䚍腉ぢ♳‫׾‬㹋植‫׋׃‬⡚慬䏝‫ֹ׏׭׆ׅ‬巉Developed in order to meet our customerˏs requirementof a low concentration high performance solution0402‫ؤ؎؟‬ ‫؝‬ٝ‫ر‬ٝ‫ך؟‬ٙ‫زح‬嵭 嵴恡嫰鯰0402 sized capacitor floating comparisonUnprocessedMelplate CULMO3䎢眔㔲‫ד‬㖱♧‫ז‬넝⯔尶‫ֹ׏׭‬淼芘‫׾‬䧭芘Deposits bright tin coatings in an extremely wide range of current densities葺㥨‫ֽ➰׌׿כז‬䚍腉Excellent solderability surface嵭㸜㹀䚍‫׸⮚ח‬ծⴓ匿盖椚〳腉High stability and easy maintenanceً‫ظة‬٦ٕծ鋉ⵖ暟颵‫׾‬ろ‫ְזת‬RoHS ꬊ鑩䔲Free from methanol nor the controlled substance are contained (Not correspond to the RoHS restriction)Measurement area : φ1.0mmTest piece : 5μm tin plating on copperDevice : Nippon Denshoku Industries co., Ltd, Densite-meter ND-11⯔尶䚍 BrightnessGAM :1.51Device : SWET-2100(Tarutin Kester Co.,Ltd.) Test piece : 5μm Tin plating on lead flameSolder : Pd36%/Sn64 215˫ Depth : 20mm Speed : 20mm/sec. Dipping time : 5secPoint : 3 PCT device : EHS-211M(Espec) PCTcondition : 105˫ 100%RH 8hr‫׌׿כ‬憛‫׸‬䚍 SolderabilityZCTAs plate 0.35sAfter PCT 0.91s㢩錁AppearanceHull cell condition 0AH/L 50AH/L 100AH/L1.0A 5min 20˫Cathode : 3m/min0.5A 10min 20˫Cathode : 3m/min害欽䚍ָ넝ֻ圫ղ‫ז‬欽鷿‫ח‬⢪欽〳腉‫ז‬⯔尶為ꃐ‫ֹ׏׭׆ׅ‬巉Melplate CULMO is a sulfuric acid based bright tin plating designed for general purpose of electro component manufacturing嵴恡‫׷״ח‬稆勞徇鍑䚍鑐꿀Corrosion by immersion test151050%‫ةأٔغ‬鿇ㅷ6.613.80.9LTCC鿇ㅷ0.2 1.00.1⟃♴45˫ 5儗꟦鑐꿀‫ؿٕأ‬؋‫ى‬ٝꃐ俑柃嵭 ‫ؙؒ‬ٝꃐ俑柃嵭Melbright NI-2226

Page 3:4LtF P-30⡚䘔⸂‫ד‬䒀䚍٥㾜䚍‫׷׸⮚ח‬ꋛ‫ֹ׏׭‬淼芘‫׾‬匿⳿Ductile and malleable copper deposit with low internal stress‫ֹ׏׭‬芘⾨‫ך‬꬗ⰻ㖱♧䚍ָ葺㥨Uniform thickness within wafer〳徇䚍ֶ‫♶ן״‬徇鍑䚍،‫ظ‬٦‫חⰟس‬⢪欽〳腉Both soluble and insoluble anodes are available幐⸇⶝‫כ‬CVS‫ⴓ׷״ח‬匿٥盖椚ָ〳腉Accurate control of additive concentration through CVS analysisSiL/S=2/2μmCu:200nmTi : 80nm Si5μmFan-Out ‫؛حػ‬٦‫أإٗفآ‬欽為ꃐꋛ‫ֹ׏׭‬幐⸇⶝Copper electrolyte for FO-Wafer Level Package/Panel Level Package process premium additive system5LtF S-40TMAH‫׾‬ろ剣‫⶟زأآٖزؓؿְז׃‬ꨄ巉TMAH free photo resist stripperpHָ⚥䚍㚖‫׭׋׷֮ד‬ծꋛծ،ٕ‫ךيؐصى‬徇鍑‫׾‬噰ꣲ‫דת‬⡚幾Minimal attack on copper and aluminum due to neutral pH秪宏‫׷״ח‬峤崭‫׶״ח‬䧭ⴓ‫ך‬婍殅ָ搀ְNo residue on copper surface after rinsingTMAH typeLtF S-403.02.52.01.51.00.50EtchingAmount/nm/minCu2.330.0004 0.0976 0.0013AlFan-Out ‫؛حػ‬٦‫آ‬ٝ‫أإٗفؚ‬欽‫⶟زأآٖزؓؿ‬ꨄ巉Photo resist stripper for FO-Wafer Level Package/Panel Level Package process醡ㅷ⻉✮㹀To be launched醡ㅷ⻉✮㹀To be launchedVertical : 20 pointsLateral : 20 points8˒ waferꋛ‫ֹ׏׭‬芘⾨庠㹀‫؎ه‬ٝ‫ز‬Plating thickness measurement pointsꋛ‫ֹ׏׭‬芘⾨㖱♧䚍Cu plating thickness uniformityꆃ㾩徇鍑鸞䏝Etching Amount of Cu and AlLtF S-40‫⶟زأآٖزؓؿ׷״ח‬ꨄ䖓‫ך‬ꋛꂁ简‫ةػ‬٦ٝ‫ה‬倖꬗䕎朐RDL pattern and cross section after photo resist stripping using LtF S-40109876543210Thickness/μm0 50 100Distance from edge/mm150 2002μm 1μm1μm1μm 1μm劢Ⳣ椚ꋛ邌꬗Copper surface before strippingTMAH禸⶟ꨄ⶝Ⳣ椚䖓‫ך‬ꋛ邌꬗Cu surface after stripping using TMAH type stripperLtF S-40Ⳣ椚䖓‫ך‬ꋛ邌꬗Cu surface after stripping using LtF S-40Target thickness : 4μm

Page 4:6LtF E-50麓為ꃐ禸 ꋛ‫ء‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬巉Persulfate type copper seed layer etchant嵴恡䒭٥卐衝䒭‫׮ח׸׆ְך‬黝欽〳Applicable for immersion and spin etching‫؜ٗع‬ֶٝ‫ٔؿيؐٔزشן״‬٦Halogen and sodium ion freeLtF E-51㢳⣣ꆃ㾩؎ؔٝ‫׾‬ꃐ⻉⶝‫׷ׅה‬ꋛ‫ء‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬巉Multivalent metal ion oxidant copper seed layer etchant‫ٖفأ‬٦䒭ؒ‫ثح‬ٝ‫ؚ‬㼎䘔Available for spray etchingꃐ⻉鼧⯋ꨵ⡘‫ٔةصٌ׾‬ٝ‫ג׃ؚ‬㖱♧‫ثحؒז‬ٝ‫ؚ‬鸞䏝‫׾‬笝䭯Consistent etching by monitoring Oxidation-Reduction PotentialFan-Out ‫؛حػ‬٦‫آ‬ٝ‫أإٗفؚ‬欽ꋛ‫ءةحػأ‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬巉FO-Wafer Level Package/Panel Level Package process copper seed layer etchant7LtF E-53麓ꃐ⻉宏稆幐⸇䒭‫ةثך‬ٝ‫ء‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬巉Etchant prepared with hydrogen peroxide for titanium seed layer etching嵴恡䒭٥卐衝䒭‫׮ח׸׆ְך‬黝欽〳Applicable for immersion and spin etching➭‫ך‬ꆃ㾩勞俱‫פ‬臰굸䚍ָ⡚ֻծ鼅䫛ؒ‫ثح‬ٝ‫ؚ‬䚍‫׷׸⮚ח‬Highly selective etching of titanium with minimum attacks on other materialsFan-Out ‫؛حػ‬٦‫آ‬ٝ‫أإٗفؚ‬欽‫ةث‬ٝ‫ءةحػأ‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬巉FO-Wafer Level Package/Panel Level Package process titanium seed layer etchant醡ㅷ⻉✮㹀To be launched醡ㅷ⻉✮㹀To be launched醡ㅷ⻉✮㹀To be launched2μm 1μm2μm1μm 200nm200nmLtF E-51‫׷״ח‬ꋛ‫ء‬٦‫س‬㾴ؒ‫ثح‬ٝ‫ؚ‬䖓‫ך‬ꋛꂁ简‫ةػ‬٦ٝ‫ה‬倖꬗䕎朐RDL pattern and cross section after Cu seed layer etching using LtF E-51㼄岀㸜㹀䚍‫ةػ׋׸⮚ח‬٦ٝ䕎䧭ָ〳腉Constantly stable patterning is achievedؒ‫ثح‬ٝ‫ؚ‬䖓‫ך‬ꋛꂁ简鿇‫ך‬،ٝ‫ت‬٦ؕ‫װزح‬ꋛꂁ简䌴‫ך‬稢‫ָ׶‬㼰‫ְז‬No noticeable undercut or Cu side wall loss after seed layer etching

Page 5:䗍㼭ꨵ噰‫ךפ‬鼅䫛涸‫ז‬搀ꨵ鍑‫׷״חֹ׏׭‬UBM䕎䧭UBM formation through selective electroless deposition on tiny electrodes㢳珏㢳圫‫ז‬ꨵ噰稆勞‫ח‬黝欽〳腉Applicable for various electrode materialsꨵ噰‫ًتךפ‬٦‫ָآ‬㼰‫ֻז‬ծ‫ٔغ‬،䚍٥䎂徽䚍‫׷׸⮚ח‬淼芘䕎䧭Uniform flat deposit with minimum damage to electrodesMelplate UBM ProcessConventional process⵸Ⳣ椚‫ךأإٗف‬剑黝⻉‫׶״ח‬ծAlꨵ噰‫ךפ‬Ni‫׾ؙ؎ػأ‬䫇ⵖNi spikes on Al electrode are effectively suppressed through optimization of pretreatment processMelplate UBM ProcessNi depositPassivationlayerTi barrierlayerSi3N4SiO2Al electrodeBeforeprocessingSiO2SiAfterprocessing1μm8⼱㼪⡤ؐؒ‫ع‬٦ꨵ噰♳‫ٔغךפ‬،㾴䕎䧭‫أإٗف‬Semiconductor wafer electrodes barrier layer formation⯔尶䏝‫⿾װ‬㼗桦‫ח‬䘔ׄ‫ג‬鼅䫛ָ〳腉Highly reflective finishing or bright finishingLEDꨵ噰欽‫ג׃ה‬ LED use넝⿾㼗桦 High reflectivityMelbright AG-2525Melbright AG-2525ꨵ孡ꋒ‫ֹ׏׭‬幐⸇⶝ Silver plating additivesMelbright AG-2525 Series 倜醡ㅷNew product鄲귅欽‫ג׃ה‬ Decorative use넝⯔尶 Full brightMelbright AG-2525BӪ害欽䚍ָ넝ֻ圫ղ‫ז‬欽鷿‫ח‬⢪欽〳腉‫ءז‬،ٝ‫ךف؎ة‬ꨵ孡ꋒ‫ֹ׏׭‬幐⸇⶝խCyanide type general purpose silver plating additivesӪLEDꨵ噰瘝‫ך‬넝⿾㼗桦‫׾‬䗳銲‫׷ׅה‬欽鷿‫ח‬剑黝խHigh reflectivity, suitable for LED useMelbright AG-2525BӪ넝⯔尶‫ך‬ꋒ‫ֹ׏׭‬淼芘ָ䖤‫ء׷׸׵‬،ٝ‫ךف؎ة‬ꨵ孡ꋒ‫ֹ׏׭‬幐⸇⶝խCyanide type silver plating additives with bright finishingӪ넝炽䏝‫ך‬ꋒ‫ֹ׏׭‬淼芘ָ䖤‫׷׸׵‬խHard silver plate provides good abrasion resistance9♧菙鄲귅欽ַ‫׵‬LED欽鷿‫דת‬䎢欽鷿‫ז‬ꨵ孡ꋒ‫ֹ׏׭‬幐⸇⶝Multi-purpose silver plating additives for use with LEDs, decoration etc

Page 6:Lucent Copper Series‫ٕـءٖؗؿ‬㛇匢ぢֽ ٔ‫زحآ‬㛇匢ぢֽLucent CopperEX‫وأ‬٦‫ز‬‫ؓؿ‬ٝ‫زحٖـة‬PCؐؑ،ٓ‫أ؎غرٕـ‬：‫ﻯ‬‫ﻳ‬＾４醡ㅷLucent CopperSVF‫وأ‬٦‫ز‬‫ؓؿ‬ٝ‫زحٖـة‬PC‫ًٕٓؕةآر‬Lucent CopperACP‫أ‬٦‫ػ‬٦‫؝‬ٝ‫ُؾ‬٦‫ة‬‫؟‬٦‫غ‬٦鸐⥋؎ٝ‫ٓؿ‬Lucent CopperAZ鮦鯹堣㐻AV堣㐻‫؝اػ‬ٝ宏䎂䵤鷏ծ♶徇鍑䚍ꤿ噰➬圫‫ך‬為ꃐꋛ‫ֹ׏׭‬幐⸇⶝For horizontal systems and insoluble anodeLucent Copper EX넝ꨵ崧㺘䏝٥⡚芘⾨‫ٔ؍ؿךד‬ٝ‫ؚ‬䚍腉ָ⮚‫׷ְג׸‬為ꃐꋛ‫ֹ׏׭‬幐⸇⶝Excellent via filling performance at high current density areasLucent Copper SVF넝،‫زؙلأ‬嫰㛇匢‫ٗأך‬٦؎ٝ‫ػؚ‬ٙ٦‫׷ְג׸⮚ח‬為ꃐꋛ‫ֹ׏׭‬幐⸇⶝Excellent throwing power specially on high aspect through holesLucent Copper ACP害欽䚍ָ넝ֻ圫ղ‫ז‬欽鷿‫ח‬⢪欽〳腉‫ז‬為ꃐꋛ‫ֹ׏׭‬幐⸇⶝Copper plating additives designed for general purpose PWB manufacturingLucent Copper AZ10‫ٕـءٖؗؿ‬㛇匢ծٔ‫حآ‬‫ز‬㛇匢瘝欽鷿ⴽ‫ח‬㼎䘔〳腉넝䚍腉為ꃐꋛ‫ֹ׏׭‬幐⸇⶝Prepared with flexible PWBs and rigid PWBsHigh performance copper plating additives‫ز‬٦‫ُٔإة‬٦‫ّء‬ٝ‫׀ך‬䲿⣘ Total Solution邌꬗Ⳣ椚‫ח‬ꟼ‫׷ׅ‬넝ְ䪮遭⸂‫ה‬濼陎‫׾‬崞欽‫׃‬ծ㉀ㅷ‫ֻזכדֽ׌‬ծֶ㹏圫‫ח‬剑黝‫ז‬չ‫ز‬٦‫ُٔإة‬٦‫ّء‬ٝպ‫׀׾‬䲿⣘ְ‫ׅת׃׋‬Using our latest technologies and long history in RD, Meltex provides Total Process Solutions for our clients.‫ؚٗ‬٦‫زحطٕغ‬ٙ٦‫ؙ‬ Global Network傈劤Ⰻ㕂‫ח‬㾜Ꟛ‫׋׃‬㕂ⰻ䬿挿‫ַקך‬ծ⚥㕂ծ껺庥ծ〴弨ծꯑ㕂ծ‫׮ח؎ة‬㌀噟䬿挿‫׾‬㾜Ꟛ‫׃‬ծֶ㹏圫‫׾‬嵲㢩‫׮ד‬䓼⸂‫ه؟ח‬٦‫ׅתְג׃ز‬Aside from our clients in Japan, Meltex supports overseas clients with strategically located overseas offices in China,Hong Kong,Taiwan, Korea, and Thailand.Chemical Processぐ珏邌꬗Ⳣ椚讒ㅷ‫׀׾أإٗفה‬䲿⣘‫חⰟה׷ׅ‬ֶ㹏圫‫صך‬٦‫חؤ‬さ‫׋ׇ׻‬Ꟛ涪‫ׅת׶ֶג׏זֶֿ׮ؤ؎وةأؕװ‬We supply not only surface finishing chemicals  processes, but we also performdevelopment and customization depending on our clientsˏrequirements.Material & Machineryワ鴟勞俱ծぐ珏‫؝‬ٝ‫ٗز‬٦ٓ٦ծ㹋꿀欽鄲縧ַ‫׵‬ꆀ欵ٓ؎ٝ‫דת‬ծ֮‫׷ײ׵‬邌꬗Ⳣ椚ワ鴟㉀ㅷ‫׀׾‬䲿⣘荜‫ׅת׃‬We also supply various surface finishing equipment. (materials, controllers,standard evaluation devices, mass production lines, etc.)Support & Consultationֶ㹏圫ָ䫴ִ‫㉏׷‬겗‫׾‬涸然‫ח‬椚鍑‫׃‬ծֶ㹏圫‫ח‬さ‫Ⳣ׋ׇ׻‬椚倯岀‫װ‬剑黝‫ه؟ז‬٦‫ز‬ծ‫ُٔا‬٦‫ّء‬ٝ‫׀׾‬䲿周荜‫ׅת׃‬If our client has any production line trouble, we work together to the find andunderstand the cause of the problem and provide customized solutions.ChinaMeltex (Tianjin) Ltd.ChinaTokyo Kakouki (Shanghai) Co.,Ltd.TaiwanMeltex Taiwan Inc.ChinaMeltex (Tianjin) Ltd. Shenzhen BranchHong KongMeltex (HK) Ltd.ThailandMeltex Asia Pacific Co.,Ltd.ThailandMeltex Asia (Thailand) Co.,Ltd.KoreaMeltex Korea Co.,Ltd.SalesR&D/Mfg.Tohoku OfficeCS CenterNagoya OfficeOsaka OfficeKyuushuu OfficeR&D CenterKumagaya PlantTokai MeltexTCM Office/FactoryTCM Kanto OfficeHead Office11