G-Titan Insight into the future

PERFORMANCE FACILITIES REQUIREMENT Machine Alignment Capability 2 Cmk @ ±10 microns @ 6 sigma Power Supply AC220V ± 10% 50/60Hz Process Alignment Capability 2 Cpk @ ±18 microns @ 6 sigma Power Consumption 3kW Core Cycle Time Air Supply 4 ~ 6Kgf/cm² (excluding printing & < 8.5 secs Air Consumption 5L/min cleaning time) Dimension (excluding Product Changeover Time < 3 mins signal tower) 1,240 mm (L) x 1,560 mm (W) x 1,490 mm (H) New Product Set-up Time < 10 mins Machine Weight 1,200kg BOARD HANDLING OPERATOR INTERFACE Max. Size (L x W) 510 mm x 510 mm Hardware LCD Monitor, Mouse & Keyboard Min. Size (L x W) 50 mm x 50 mm Operating System (OS) Windows 7 or Higher Thickness 0.4~6 mm Control Method Industrial PC controlled PCB Thickness I/O Interface SMEMA Standard Adjustment Automatic Insight into the future PCB Max. Weight 5kg STANDARD FEATURES: PCB Edge Clearance 3 mm Auto paste replenishment (OPC) PCB Bottom Clearance 23 mm Paste rolling diameter monitoring system (OPC) PCB Warpage Max. 1% diagonally OPC squeegee assembly (2 pairs 300mm & 450mm) Clamping Method Auto retractable top clamp, Stencil flattener (QPC) motor controlled side clamp Stencil apertures inspection system (QPC) Support Method Magnetic support pins, bars, blocks, vacuum suction OPTIONS L to R, R to L, R to R, L to L SPI closed-loopConveyor Direction (software control) Auto glue dispensing Conveyor Height 900 ± 40 mm Temperature, humidity monitoring & display Conveyor Speed (max.) 1,500 mm/s Internal/External barcode scanner for PCB traceability Conveyor Width Automatic Handheld barcode scanner for stencil, solder paste, squeegee traceability Adjustment MES system integration (For Ind. 4.0) 2 machines in series for higher output OPTICAL SYSTEM 2 machines back to back for dual lane SMT line Field-of-View (FOV) 10mm x 8mm Fiducial Types Circle, triangle, square, diamond, cross Fiducial Size 0.5~4.0 mm Vision Methodology Digital CCD camera look up & down 2D Inspection Max.100 windows to inspect missing & insufficient (std.) PRINTING PARAMETERS Stencil Frame Size (L x W) Adjustable, 470 mm x 370 mm to 737 mm x 737 mm Print Gap (snap-off) 0~20 mm Printing Table Adjustment Range X: ±10 mm, Y: ±10 mm : ± 2° Print Speed 10~200 mm/s Squeegee Pressure 0.5~10kg (program control) Std.: OPC Squeegee 300 mm, Squeegee Type 450 mm & Metal Squeegee 520mm. Option: Rubber Squeegee Angle Std. 60°, Option 45°, 50°, 55° Cleaning System Auto wet, dry, vacuum (Software select) GKG PRECISION MACHINE CO., LTD. GKG ASIA PTE LTD Manufacturing - R&D Centre Global Marketing & Training Centre No. 2 Shalang Road, Dong Cheng District Dongguan City Service & Spare Parts Support Centre Guangdong Province China 52 Ubi Avenue 3, #02-38 Frontier, Singapore 408867 Tel: +86 769 2276 7281, 3882 3222 Tel: +65 6547 8065 | Fax: +65 6547 5451 Fax: +86 769 3882 0799 www.gkgasia.com www.gkg.cn ©GKG, all rights reserved. *GKG reserves the right to make any changes concerning design or specification of the machine without any prior notice for continuous improvement. (G-Titan Version 1.0 2017.07)

STANDARD FEATURES & PERFORMANCE OPTIONS OPTI-PASTE CONTROL (OPC) - GET READY FOR LIGHTS - OUT • R eady for Industry 4.0 – Through MANUFACTURING machine status, parameters can be uploaded automatically. 1. A uto Paste Dispensing – The paste is Designed to support customers’ automatically dispensed across the entire advancement towards Industry squeegee length, maintaining at 15mm 4.0 intelligence production, G-Titan rolling diameter, adopting the common provides seamless connection 500 grams’ solder paste jar. Completely with users’ MES system, eliminates the wastage of solder paste enhancing product traceability overflowing to the sides of squeegee. and maintenance needs. 2. P aste Rolling Diameter Monitoring System – Tracing solder paste rolling diameter in real time and trigger the auto dispensing if it falls below 10mm. • S PI Close-loop Connection – Completely eliminate insufficient solder With SPI close-loop system, paste on stencil and keep the paste rolling speed within optimum range to achieve machine will automatically adjust best printing result. and correct the print deposits based on the feedback given with regards to poor printing quality. 3. OPC Squeegee – Retainers at both sides This will facilitate improved print can be adjusted to the exact length of the quality and production efficiency, PCB, enabling solder paste to be retained within the PCB length to obtain a clean by forming a complete printing sweep. Possess absolute control over feedback system. desired printing area, to achieve best printing quality. QUALITY PRINT CONTROL (QPC) - NOTHING IS MORE IMPORTANT THAN A GOOD PRINT • Back to Back (BTB) 2 Machines back to back is a 1. S tencil Aperture Inspection System - perfect match to all dual lane Using panel light installed at the top and SMT lines. The machines can be CCD camera below to inspect stencil operated independently of each apertures. It automatically detects the other, running different types of clogging of stencil apertures to eliminate product. poor quality stencil being used, ensure quality printing right from the start. 2. T he Stencil Flattener & PCB Clamper – The Stencil Flattener sucks the stencil firmly on both sides of the conveyor during printing cycle. To eliminate stencil vibration • Auto Glue Dispensing – Attached by having firm contact with PCB. The PCB clamper is a combination of retractable top on CCD Camera XY axis, the clamp and motor controlled side clamp, dispenser provides basic function uniquely designed by GKG (patented). With of glue dotting using syringe type these standard features, all of today’s dispensing needle after solder available and challenging substrates can paste printing. be securely clamped and print to the highest quality.