LOC110 Single Linear Optocoupler

LOC110 Single Linear Optocoupler INTEGRATED CIRCUITS DIVISION Parameter Rating Units Description LED Operating Range 2 - 10 mA The LOC110 Single Linear Optocoupler features an K3, Transfer Gain 0.668 - 1.179 - infrared LED optically coupled with two photodiodes. Isolation, Input to Output 3750 V One feedback (input) photodiode is used to generate rms a control signal that provides a servomechanism to the LED drive current, thus compensating Features for the LED's nonlinear time and temperature • 0.01% Servo Linearity characteristics. The other (output) photodiode • THD -87dB Typical provides an output signal that is linear with respect • Wide Bandwidth (>200kHz) to the servo LED current. The product features • Couples Analog and Digital Signals wide bandwidth, high input to output isolation, and • High Gain Stability excellent servo linearity. • Low Input/Output Capacitance Approvals • Low Power Consumption • 8-Pin Flatpack or DIP Package • UL Recognized Component: File # E76270 • Surface Mount and Tape & Reel Versions Available • CSA Certified Component: Certificate # 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate # B 13 12 82667 003 Applications Ordering Information • Modem Transformer Replacement With No Insertion Loss Part Number Description • Digital Telephone Isolation LOC110 8-Pin DIP (50/Tube) • Power Supply Feedback Voltage/Current LOC110P 8-Pin Flatpack (50/Tube) • Medical Sensor Isolation LOC110PTR 8-Pin Flatpack (1000/Reel) • Audio Signal Interfacing LOC110S 8-Pin Surface Mount (50/tube) • Isolation of Process Control Transducers LOC110STR 8-Pin Surface Mount (1000/Reel) Each tube or reel will contain only devices of one K3-sorted value. Devices will be individually marked with the letter of their K3 bin. K3 Sorted Bins Bin C = 0.668 - 0.732 Bin D = 0.733 - 0.805 Bin E = 0.806 - 0.886 Bin F = 0.887 - 0.974 Bin G = 0.975 - 1.072 Bin H = 1.073 - 1.179 Devices of any available bin will be shipped. Pin Configuration 1 8 - LED N/C 2 7 + LED N/C 3 6 C1 C2 4 5 A1 A2 DS-LOC110-R11 www.ixysic.com 1

INTEGRATED CIRCUITS DIVISION LOC110 Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Absolute Maximum Ratings are stress ratings. Stresses in Reverse LED Voltage 5 V excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions Input Control Current 100 mA beyond those indicated in the operational sections of this Peak (10ms) 1 A data sheet is not implied. Input Power Dissipation1 150 mW Total Package Dissipation2 500 mW Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are Isolation Voltage, Input to Output 3750 Vrms provided for information purposes only, and are not part of Operational Temperature -40 to +85 °C the manufacturing testing requirements. Storage Temperature -40 to +125 °C 1 Derate linearly 1.33 mW / °C 2 Derate linearly 6.67 mW / °C Electrical Characteristics @ 25ºC Parameter Conditions Symbol Min Typ Max Units Input Characteristics LED Voltage Drop IF = 2 - 10mA VF 0.9 1.2 1.4 V Reverse LED Current VR = 5V IR - - 10 A Coupler/Detector Characteristics Dark Current IF=0mA, VC1-A1=VC2-A2=15V ID - 1 25 nA K1, Servo Gain (IC1/IF) K1 0.004 0.007 0.030 - K2, Forward Gain (IC2/IF) IF=2 - 10mA, VC1-A1=VC2-A2=15V K2 0.004 0.007 0.030 - K3, Transfer Gain (K2/K1=IC2/IC1) K3 0.668 - 1.179 - K3, Transfer Gain Linearity (non-servoed) IF=2 - 10mA K3 - - 1 % K3 Temperature Coefficient IF=2 - 10mA, VC1-A1=VC2-A2= 5V K3/T - 0.005 - % / ºC Common-Mode Rejection Ratio V=20VP-P , RL=2k, f=100Hz CMRR - 130 - dB Total Harmonic Distortion f0=350Hz, 0dBm THD -96 -87 -80 dB Frequency Response 1 Photoconductive Configuration 200 f - - kHz Photovoltaic Configuration -3dB 40 Capacitance, Input to Output VIO=0V, f=1MHz CIO - 3 - pF 1 Refer to Application Note, AN-107, for LOC110 Configurations. 2 www.ixysic.com R11

INTEGRATED CIRCUITS DIVISION LOC110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Current LED Forward Current Typical LED Forward Voltage Drop vs. LED Forward Voltage vs. LED Forward Voltage vs. Temperature 60 100 1.6 IF=50mA 50 1.5 IF=20mA 10 IF=10mA 40 1.4 30 1 1.3 20 1.2 0.1 IF=5mA 10 1.1 IF=2mA IF=1mA 0 0.01 1.0 1.0 1.1 1.2 1.3 1.4 1.5 1.0 1.1 1.2 1.3 1.4 1.5 -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) LED Forward Voltage (V) Temperature (ºC) Servo Gain Servo-Photocurrent Normalized Servo-Photocurrent vs. LED Current & Temperature vs. LED Current & Temperature vs. LED Current & Temperature 0.016 140 4.0 0ºC 120 3.5 0ºC 0ºC 25ºC 0.012 3.0 25ºC 25ºC 100 50ºC 50ºC 50ºC 70ºC 2.5 70ºC 70ºC 80 0.008 85ºC 85ºC 85ºC 2.0 60 1.5 0.004 40 1.0 20 0.5 0.000 0 0.0 0 2 4 6 8 10 12 0 2 4 6 8 10 12 0 2 4 6 8 10 12 LED Current (mA) LED Current (mA) LED Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. R11 www.ixysic.com 3 Servo Gain LED Current (mA) Servo-Photocurrent ( A) LED Current (mA) Normalized Servo-Photocurrent LED Forward Voltage Drop (V)

INTEGRATED CIRCUITS DIVISION LOC110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation LOC110 / LOC110S MSL 1 LOC110P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (TC) Dwell Time (tp) Max Refl ow Cycles LOC110 250ºC N/A LOC110S 250ºC 30 seconds 3 LOC110P 240ºC 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R11

INTEGRATED CIRCUITS DIVISION LOC110 Mechanical Dimensions LOC110 9.652 ± 0.381 7.620 ± 0.254 PCB Hole Pattern 2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010) (0.100 ± 0.005) 8-0.800 DIA. 2.540 ± 0.127 (8-0.031 DIA.) (0.100 ± 0.005) 6.350 ± 0.127 9.144 ± 0.508 (0.250 ± 0.005) (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 0.457 ± 0.076 (0.130 ± 0.002) (0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127 (0.285) (0.300 ± 0.005) 7.620 ± 0.127 4.064 TYP (0.300 ± 0.005) (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions 0.813 ± 0.102 mm (0.032 ± 0.004) (inches) LOC110P 2.286 MAX. PCB Land Pattern (0.090 MAX.) 2.540 ± 0.127 0 MIN / 0.102 MAX (0.100 ± 0.005) (0 MIN / 0.004 MAX) 2.54 (0.10) 6.350 ± 0.127 7.620 ± 0.254 0.635 ± 0.127 9.398 ± 0.127 (0.250 ± 0.005) (0.025 ± 0.005) (0.370 ± 0.005) (0.300 ± 0.010) 8.70 1.55 (0.3425) Pin 1 0.203 ± 0.013 (0.0610) 9.652 ± 0.381 (0.008 ± 0.0005) (0.380 ± 0.015) 0.65 2.159 ± 0.025 (0.0255) (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) Dimensions 0.864 ± 0.120 mm (0.034 ± 0.004) (inches) LOC110S 9.652 ± 0.381 PCB Land Pattern (0.380 ± 0.015) 0.635 ± 0.127 2.540 ± 0.127 3.302 ± 0.051 (0.025 ± 0.005) 2.54 (0.100 ± 0.005) (0.130 ± 0.002) (0.10) 6.350 ± 0.127 9.525 ± 0.254 (0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90 (0.0649) (0.3503) 7.620 ± 0.254 Pin 1 (0.300 ± 0.010) 0.457 ± 0.076 0.254 ± 0.0127 (0.018 ± 0.003) (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions 0.813 ± 0.102 mm (0.032 ± 0.004) (inches) R11 www.ixysic.com 5

INTEGRATED CIRCUITS DIVISION LOC110 LOC110PTR Tape & Reel 2.00 4.00 330.2 DIA. (0.079) (0.157) (13.00 DIA.) 7.50 W = 16.00 Top Cover (0.295) (0.63) Tape Thickness 0.102 MAX. Bo = 10.30 (0.004 MAX.) (0.406) K = 2.70 P = 12.00 Ao = 10.30 0 (0.472) (0.406) (0.106) Dimensions K1 = 2.00 Embossed Carrier (0.079) User Direction of Feed mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LOC110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover W=16.00 Tape Thickness Bo=10.30 (0.63) 0.102 MAX. (0.406) (0.004 MAX.) Ao=10.30 P=12.00 K =4.90 (0.406) (0.472) 0 (0.193) K1 =4.20 User Direction of Feed (0.165) Embossed Carrier Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 Embossment 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-LOC110-R11 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6 2/1/2016