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High Performance Fast Recovery Diode Low Loss and Soft Recovery
このカタログについて
ドキュメント名 | HiPerFRED DSEP29-12A |
---|---|
ドキュメント種別 | 製品カタログ |
ファイルサイズ | 107.1Kb |
取り扱い企業 | マウザー・エレクトロニクス (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
Page1
DSEP29-12A
HiPerFRED VRRM = 1200 V
I FAV = 30 A
t rr = 40ns
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DSEP29-12A
Backside: cathode
3 1
Features / Advantages: Applications: Package: TO-220
● Planar passivated chips ● Antiparallel diode for high frequency ● Industry standard outline
● Very low leakage current switching devices ● RoHS compliant
● Very short recovery time ● Antisaturation diode ● Epoxy meets UL 94V-0
● Improved thermal behaviour ● Snubber diode
● Very low Irm-values ● Free wheeling diode
● Very soft recovery behaviour ● Rectifiers in switch mode power
● Avalanche voltage rated for reliable operation supplies (SMPS)
● Soft reverse recovery for low EMI/RFI ● Uninterruptible power supplies (UPS)
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Terms Conditions of usage:
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact your local sales office.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20160921b
© 2016 IXYS all rights reserved
Page2
DSEP29-12A
Fast Diode Ratings
Symbol Definition Conditions min. typ. max. Unit
VRSM max. non-repetitive reverse blocking voltage T V J = 25°C 1200 V
VRRM max. repetitive reverse blocking voltage T V J = 25°C 1200 V
I R reverse current, drain current VR = 1 2 0 0 V T V J = 25°C 250 µA
VR = 1 2 0 0 V T V J = 1 5 0 °C 1 mA
VF forward voltage drop I F = 3 0 A T V J = 25°C 2.75 V
I F = 6 0 A 3.30 V
I F = 3 0 A T V J = 1 5 0 °C 1.81 V
I F = 6 0 A 2.34 V
I FAV average forward current T C = 1 2 0 °C T V J = 1 7 5 °C 30 A
rectangular d = 0.5
VF0 threshold voltage T V J = 1 7 5 °C 1.12 V
for power loss calculation only
rF slope resistance 16.6 mΩ
R thJC thermal resistance junction to case 0.9 K/W
R thCH thermal resistance case to heatsink 0.50 K/W
Ptot total power dissipation T C = 25°C 165 W
IFSM max. forward surge current t = 10 ms; (50 Hz), sine; VR = 0 V T V J = 45°C 200 A
CJ junction capacitance VR = 6 0 0 V f = 1 MHz T V J = 25°C 12 pF
IRM max. reverse recovery current TVJ = 25 °C 8.5 A
IF = 30 A; VR = 600 V TVJ = 100°C 13 A
t rr reverse recovery time -di F /dt = 200A/µs TVJ = 25 °C 60 ns
TVJ = 100°C 170 ns
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20160921b
© 2016 IXYS all rights reserved
Page3
DSEP29-12A
Package TO-220 Ratings
Symbol Definition Conditions min. typ. max. Unit
I RMS RMS current per terminal 35 A
TVJ virtual junction temperature -55 175 °C
Top operation temperature -55 150 °C
Tstg storage temperature -55 150 °C
Weight 2 g
MD mounting torque 0.4 0.6 Nm
F
C mounting force with clip 20 60 N
Product Marking
Part Number XXXXXX
Logo Zyyww
Assembly Line
Lot # abcdef
Date Code
Ordering Ordering Number Marking on Product Delivery Mode Quantity Code No.
Standard DSEP29-12A DSEP29-12A Tube 50 477125
Similar Part Package Voltage class
DSEP29-12B TO-220AC (2) 1200
DSEP30-12A TO-247AD (2) 1200
DSEP30-12AR ISOPLUS247 (2) 1200
DSEP30-12B TO-247AD (2) 1200
Equivalent Circuits for Simulation * on die level T V J = 175 °C
I V R Fast
0 0
Diode
V0 max threshold voltage 1.12 V
R0 max slope resistance * 13.3 mΩ
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20160921b
© 2016 IXYS all rights reserved
Page4
DSEP29-12A
Outlines TO-220
A Dim. Millimeter Inches
= supplier option
A1 Min. Max. Min. Max.
E
A 4.32 4.82 0.170 0.190
A1 1.14 1.39 0.045 0.055
ØP A2 2.29 2.79 0.090 0.110
4
b 0.64 1.01 0.025 0.040
b2 1.15 1.65 0.045 0.065
C 0.35 0.56 0.014 0.022
1 3 D 14.73 16.00 0.580 0.630
2x b2 E 9.91 10.66 0.390 0.420
e 5.08 BSC 0.200 BSC
H1 5.85 6.85 0.230 0.270
L 12.70 13.97 0.500 0.550
2x b L1 2.79 5.84 0.110 0.230
C
e ØP 3.54 4.08 0.139 0.161
A2 Q 2.54 3.18 0.100 0.125
3 1
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20160921b
© 2016 IXYS all rights reserved
L1 Q
L D
H1
Page5
DSEP29-12A
Fast Diode
70 5 60
T = 100°C
VJ
V = 600 V
60 R
50
T = 150°C 4
VJ I = 60 A
F
50 100°C 30 A
25°C I = 60 A
F 40 15 A
I 40 Q 3 30 A
F r I
15 A RM
30
[A] 30 [µC] 2 [A]
20
20
1
10 10
T = 100°C
VJ
V = 600 V
R
0 0 0
0 1 2 3 4 100 1000 0 200 400 600 800 1000
VF [V] -di F /dt [A/µs] -di F /dt [A/µs]
Fig. 1 Forward current Fig. 2 Typ. reverse recov. charge Fig. 3 Typ. peak reverse current
IF versus VF Qr versus -diF /dt IRM versus -diF /dt
2.0 220 120 1.2
T = 100°C
VJ
V = 600 V
R T = 100°C
100 VJ 1.0
200 I = 30 A
F
1.5
I = 60 A 80 0.8
F
t 180 30 A VFR
rr
K 15 A t
1.0 60 0.6 fr
f
[ns] [V] [µs]
160
I 40 0.4
RM
0.5
140
Q 20 0.2
R
V trr
FR
0.0 120 0 0.0
0 40 80 120 160 0 200 400 600 800 1000 0 200 400 600 800 1000
TVJ [°C] -di F /dt [A/µs] -di F /dt [A/µs]
Fig. 4 Typ. dynamic parameters Fig. 5 Typ. recovery time Fig. 6 Typ. peak forward voltage
Qr, IRM versus TVJ trr versus -diF /dt VFR and tfr versus diF /dt
1
0.1
Constants for ZthJC calculation:
ZthJC
[K/W] i Rthi (K/W) ti (s)
1 0.030 0.001
0.01
2 0.080 0.030
3 0.300 0.006
4 0.490 0.060
0.001
0.00001 0.0001 0.001 0.01 0.1 1
t [s]
Fig. 7 Transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20160921b
© 2016 IXYS all rights reserved