1/103ページ
ダウンロード(4.3Mb)
XMC4000 Family ARM Cortex-M4 32-bit processor core
このカタログについて
ドキュメント名 | XMC4400 Microcontroller Series for Industrial Applications |
---|---|
ドキュメント種別 | 製品カタログ |
ファイルサイズ | 4.3Mb |
取り扱い企業 | マウザー・エレクトロニクス (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
Page1
XMC4400
Microcontroller Series
for Industrial Applications
XMC4000 Family
ARM® Cortex®-M4
32-bit processor core
Data Sheet
V1.3 2018-09
Microcontrol lers
Page2
Edition 2018-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2018 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Page3
XMC4400
Microcontroller Series
for Industrial Applications
XMC4000 Family
ARM® Cortex®-M4
32-bit processor core
Data Sheet
V1.3 2018-09
Microcontrol lers
Page4
XMC4400
XMC4000 Family
XMC4400 Data Sheet
Revision History: V1.3 2018-09
Previous Versions:
V1.2 2015-12
V1.1 2014-03
V1.0 2013-10
V0.6 2012-11
Page Subjects
46 Added RMS Noise parameter in VADC Parameters table.
12 Added a section listing the packages of the different markings.
14 Added BA marking variant.
37 Added footnote explaining minimum VBAT requirements to start the
hibernate domain and/or oscillation of a crystal on RTC_XTAL.
38 Changed pull device definition to System Requirement (SR) to reflect that
the specified currents are defined by the characteristics of the external
load/driver.
38 Added information that PORST Pull-up is identical to the pull-up on
standard I/O pins.
45 Updated CAINSW, CAINTOT and RAIN parameters with improved values.
59 Added footnote on test configuration for LPAC measurement.
61 Corrected parameter name of of USB pull device (upstream port receiving)
definition according to USB standard (referenced to DM instead of DP)
66 Relaxed RTC_XTAL VPPX parameter value and changed it to a system
requirement.
70 Added footnote on current consumption by enabling of fCCU.
71 Added Flash endurance parameter for 64 Kbytes Physical Sector PS4
NEPS4 for devices with BA marking.
many Added PG-TQFP-64-19 and PG-LQFP-100-25 package information.
97, 100 Added tables describing the differences between PG-LQFP-100-11 to PG-
LQFP-100-25 as well as PG-LQFP-64-19 to PG-TQFP-64-19 packages.
102 Updated to JEDEC standard J-STD-020D for the moisture sensitivity level
and added solder temperature parameter according to the same standard.
Data Sheet V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page5
XMC4400
XMC4000 Family
Trademarks
C166™, TriCore™, XMC™ and DAVE™ are trademarks of Infineon Technologies AG.
ARM®, ARM Powered®, Cortex®, Thumb® and AMBA® are registered trademarks of
ARM, Limited.
CoreSight™, ETM™, Embedded Trace Macrocell™ and Embedded Trace Buffer™ are
trademarks of ARM, Limited.
Synopsys™ is a trademark of Synopsys, Inc.
We Listen to Your Comments
Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page6
Table of Contents
XMC4400
XMC4000 Family
Table of Contents
Table of Contents
1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2 Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 Package Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.4 Device Type Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.5 Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.6 Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.1 Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2.1 Package Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.2.2 Port I/O Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.2.2.1 Port I/O Function Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3 Power Connection Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.3 Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.1.4 Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.1.5 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.2 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2.1 Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2.2 Analog to Digital Converters (ADCx) . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.2.3 Digital to Analog Converters (DACx) . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.2.4 Out-of-Range Comparator (ORC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.2.5 High Resolution PWM (HRPWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.2.5.1 HRC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.2.5.2 CMP and 10-bit DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.2.5.3 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.2.6 Low Power Analog Comparator (LPAC) . . . . . . . . . . . . . . . . . . . . . . . . 59
3.2.7 Die Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.2.8 USB OTG Interface DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 61
3.2.9 Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.2.10 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.2.11 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.3 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.3.1 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.3.2 Power-Up and Supply Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
3.3.3 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Data Sheet 6 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page7
XMC4400
XMC4000 Family
Table of Contents
3.3.4 Phase Locked Loop (PLL) Characteristics . . . . . . . . . . . . . . . . . . . . . . 77
3.3.5 Internal Clock Source Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 78
3.3.6 JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
3.3.7 Serial Wire Debug Port (SW-DP) Timing . . . . . . . . . . . . . . . . . . . . . . . . 82
3.3.8 Embedded Trace Macro Cell (ETM) Timing . . . . . . . . . . . . . . . . . . . . . 83
3.3.9 Peripheral Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
3.3.9.1 Delta-Sigma Demodulator Digital Interface Timing . . . . . . . . . . . . . . 84
3.3.9.2 Synchronous Serial Interface (USIC SSC) Timing . . . . . . . . . . . . . . 85
3.3.9.3 Inter-IC (IIC) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
3.3.9.4 Inter-IC Sound (IIS) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . 90
3.3.10 USB Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
3.3.11 Ethernet Interface (ETH) Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 93
3.3.11.1 ETH Measurement Reference Points . . . . . . . . . . . . . . . . . . . . . . . . 93
3.3.11.2 ETH Management Signal Parameters (ETH_MDC, ETH_MDIO) . . . 94
3.3.11.3 ETH RMII Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
4 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
4.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
4.1.1 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
4.2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
5 Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Data Sheet 7 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page8
About this Document
XMC4500
XMC4000 Family
About this Document
About this Document
This Data Sheet is addressed to embedded hardware and software developers. It
provides the reader with detailed descriptions about the ordering designations, available
features, electrical and physical characteristics of the XMC4500 series devices.
The document describes the characteristics of a superset of the XMC4500 series
devices. For simplicity, the various device types are referred to by the collective term
XMC4500 throughout this manual.
XMC4000 Family User Documentation
The set of user documentation includes:
• Reference Manual
– decribes the functionality of the superset of devices.
• Data Sheets
– list the complete ordering designations, available features and electrical
characteristics of derivative devices.
• Errata Sheets
– list deviations from the specifications given in the related Reference Manual or
Data Sheets. Errata Sheets are provided for the superset of devices.
Attention: Please consult all parts of the documentation set to attain consolidated
knowledge about your device.
Application related guidance is provided by Users Guides and Application Notes.
Please refer to http://www.infineon.com/xmc4000 to get access to the latest versions
of those documents.
Data Sheet 8 V1.5, 2017-12
Subject to Agreement on the Use of Product Information
Page9
1 Summary of Features
XMC4400
XMC4000 Family
Summary of Features
1 Summary of Features
The XMC4400 devices are members of the XMC4000 Family of microcontrollers based
on the ARM Cortex-M4 processor core. The XMC4000 is a family of high performance
and energy efficient microcontrollers optimized for Industrial Connectivity, Industrial
Control, Power Conversion, Sense & Control.
System System SCU
Masters Slaves
CPU RTC
ARM® CortexTM-M4 ERU0
WDT
GPDMA0 Ethernet USB
OTG
System DCode ICode FCE
Bus Matrix
Data Code
PMU PSRAM DSRAM1 DSRAM2
ROM & Flash
USIC0 DSD POSIF1 CCU80 CCU81 HRPWM LEDTS0 CCU43 PORTS DAC
PBA0 Peripherals 0 Peripherals 1 PBA1
ERU1 VADC POSIF0 CCU40 CCU41 CCU42 USIC1 CAN
Figure 1 XMC4400 System Block Diagram
CPU Subsystem
• CPU Core
– High Performance 32-bit ARM Cortex-M4 CPU
– 16-bit and 32-bit Thumb2 instruction set
– DSP/MAC instructions
– System timer (SysTick) for Operating System support
• Floating Point Unit
• Memory Protection Unit
• Nested Vectored Interrupt Controller
• One General Purpose DMA with up-to 8 channels
• Event Request Unit (ERU) for programmable processing of external and internal
service requests
• Flexible CRC Engine (FCE) for multiple bit error detection
Data Sheet 9 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page10
XMC4400
XMC4000 Family
Summary of Features
On-Chip Memories
• 16 KB on-chip boot ROM
• 16 KB on-chip high-speed program memory
• 32 KB on-chip high speed data memory
• 32 KB on-chip high-speed communication memory
• 512 KB on-chip Flash Memory with 4 KB instruction cache
Communication Peripherals
• Ethernet MAC module capable of 10/100 Mbit/s transfer rates
• Universal Serial Bus, USB 2.0 host, Full-Speed OTG, with integrated PHY
• Controller Area Network interface (MultiCAN), Full-CAN/Basic-CAN with two nodes,
64 message objects (MO), data rate up to 1MBit/s
• Four Universal Serial Interface Channels (USIC), providing four serial channels,
usable as UART, double-SPI, quad-SPI, IIC, IIS and LIN interfaces
• LED and Touch-Sense Controller (LEDTS) for Human-Machine interface
Analog Frontend Peripherals
• Four Analog-Digital Converters (VADC) of 12-bit resolution, 8 channels each, with
input out-of-range comparators
• Delta Sigma Demodulator with four channels, digital input stage for A/D signal
conversion
• Digital-Analog Converter (DAC) with two channels of 12-bit resolution
Industrial Control Peripherals
• Two Capture/Compare Units 8 (CCU8) for motor control and power conversion
• Four Capture/Compare Units 4 (CCU4) for use as general purpose timers
• Four High Resoultion PWM (HRPWM) channels
• Two Position Interfaces (POSIF) for servo motor positioning
• Window Watchdog Timer (WDT) for safety sensitive applications
• Die Temperature Sensor (DTS)
• Real Time Clock module with alarm support
• System Control Unit (SCU) for system configuration and control
Input/Output Lines
• Programmable port driver control module (PORTS)
• Individual bit addressability
• Tri-stated in input mode
• Push/pull or open drain output mode
• Boundary scan test support over JTAG interface
Data Sheet 10 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page11
1.1 Ordering Information、1.2 Device Types
XMC4400
XMC4000 Family
Summary of Features
On-Chip Debug Support
• Full support for debug features: 8 breakpoints, CoreSight, trace
• Various interfaces: ARM-JTAG, SWD, single wire trace
1.1 Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. The code “XMC4<DDD>-<Z><PPP><T><FFFF>” identifies:
• <DDD> the derivatives function set
• <Z> the package variant
– E: LFBGA
– F: LQFP
– Q: VQFN
• <PPP> package pin count
• <T> the temperature range:
– F: -40°C to 85°C
– K: -40°C to 125°C
• <FFFF> the Flash memory size.
For ordering codes for the XMC4400 please contact your sales representative or local
distributor.
This document describes several derivatives of the XMC4400 series, some descriptions
may not apply to a specific product. Please see Table 1.
For simplicity the term XMC4400 is used for all derivatives throughout this document.
1.2 Device Types
These device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 1 Synopsis of XMC4400 Device Types
Derivative1) Package Flash Kbytes SRAM
Kbytes
XMC4400-F100x512 PG-LQFP-100 512 80
XMC4400-F64x512 PG-yQFP-642) 512 80
XMC4400-F100x256 PG-LQFP-100 256 80
XMC4400-F64x256 PG-yQFP-642) 256 80
XMC4402-F100x256 PG-LQFP-100 256 80
XMC4402-F64x256 PG-yQFP-642) 256 80
1) x is a placeholder for the supported temperature range.
2) y is a placeholder for the QFP package variant, LQFP or TQFP depending on the stepping, see Section 1.3.
Data Sheet 11 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page12
1.3 Package Variants、1.4 Device Type Features
XMC4400
XMC4000 Family
Summary of Features
1.3 Package Variants
Different markings of the XMC4400 use different package variants. Details of those
packages are given in the Package Parameters section of the Data Sheet.
Table 2 XMC4400 Package Variants
Package Variant Marking Package
XMC4400-F100 EES-AA, ES-AA, ES-AB, AB PG-LQFP-100-11
XMC4400-F64 PG-LQFP-64-19
XMC4400-F100 BA PG-LQFP-100-25
XMC4400-F64 PG-TQFP-64-19
1.4 Device Type Features
The following table lists the available features per device type.
Table 3 Features of XMC4400 Device Types
Derivative1) LEDTS Intf. ETH USB USIC MultiCAN
Intf. Intf. Chan. Nodes, MO
XMC4400-F100x512 1 RMII 1 2 x 2 N0, N1
MO[0..63]
XMC4400-F64x512 1 RMII 1 2 x 2 N0, N1
MO[0..63]
XMC4400-F100x256 1 RMII 1 2 x 2 N0, N1
MO[0..63]
XMC4400-F64x256 1 RMII 1 2 x 2 N0, N1
MO[0..63]
XMC4402-F100x256 1 − 1 2 x 2 N0, N1
MO[0..63]
XMC4402-F64x256 1 − 1 2 x 2 N0, N1
MO[0..63]
1) x is a placeholder for the supported temperature range.
Data Sheet 12 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page13
1.5 Definition of Feature Variants
XMC4400
XMC4000 Family
Summary of Features
Table 4 Features of XMC4400 Device Types
Derivative1) ADC DSD DAC CCU4 CCU8 POSIF HRPWM
Chan. Chan. Chan. Slice Slice Intf. Intf.
XMC4400-F100x512 24 4 2 4 x 4 2 x 4 2 1
XMC4400-F64x512 14 4 2 4 x 4 2 x 4 2 1
XMC4400-F100x256 24 4 2 4 x 4 2 x 4 2 1
XMC4400-F64x256 14 4 2 4 x 4 2 x 4 2 1
XMC4402-F100x256 24 4 2 4 x 4 2 x 4 2 1
XMC4402-F64x256 14 4 2 4 x 4 2 x 4 2 1
1) x is a placeholder for the supported temperature range.
1.5 Definition of Feature Variants
The XMC4400 types are offered with several memory sizes and number of available
VADC channels. Table 5 describes the location of the available Flash memory, Table 6
describes the location of the available SRAMs, Table 7 the available VADC channels.
Table 5 Flash Memory Ranges
Total Flash Size Cached Range Uncached Range
256 Kbytes 0800 0000H − 0C00 0000H −
0803 FFFFH 0C03 FFFFH
512 Kbytes 0800 0000H − 0C00 0000H −
0807 FFFFH 0C07 FFFFH
Table 6 SRAM Memory Ranges
Total SRAM Size Program SRAM System Data SRAM Communication
Data SRAM
80 Kbytes 1FFF C000H − 2000 0000H − 2000 8000H −
1FFF FFFFH 2000 7FFFH 2000 FFFFH
Data Sheet 13 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page14
1.6 Identification Registers
XMC4400
XMC4000 Family
Summary of Features
Table 7 ADC Channels1)
Package VADC G0 VADC G1 VADC G2 VADC G3
PG-LQFP-100 CH0..CH7 CH0..CH7 CH0..CH3 CH0..CH3
PG-LQFP-64 CH0, CH0, CH1, CH0, CH1 CH2, CH3
CH3..CH7 CH3, CH6
1) Some pins in a package may be connected to more than one channel. For the detailed mapping see the Port
I/O Function table.
1.6 Identification Registers
The identification registers allow software to identify the marking.
Table 8 XMC4400 Identification Registers
Register Name Value Marking
SCU_IDCHIP 0004 4001H EES-AA, ES-AA
SCU_IDCHIP 0004 4002H ES-AB, AB
SCU_IDCHIP 0004 4003H BA
JTAG IDCODE 101D C083H EES-AA, ES-AA
JTAG IDCODE 201D C083H ES-AB, AB
JTAG IDCODE 301D C083H BA
Data Sheet 14 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page15
2 General Device Information、2.1 Logic Symbols
XMC4400
XMC4000 Family
General Device Information
2 General Device Information
This section summarizes the logic symbols and package pin configurations with a
detailed list of the functional I/O mapping.
2.1 Logic Symbols
VAREF VAGND VDDA VSSA VDDC VDDP VSS
(1) (1) (1) (1) (4) (4) (1)
VBAT (1) Exp. Die Pad
(VSS)
RTC_XTAL1 (1) VSSO
RTC_XTAL2
Port 0
HIB_IO_0 13 bit
HIB_IO_1 Port 1
16 bit
XTAL1
XTAL2 Port 2
13 bit
USB_DP Port 3
USB_DM 7 bit
VBUS Port 4
2 bit
Port 14
14 bit Port 5
4 bit
Port 15
4 bit
PORST TCK JTAG ETM / SWD
3 bit 5 / 1 bit
TMS via Port Pins
Figure 2 XMC4400 Logic Symbol PG-LQFP-100
Data Sheet 15 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page16
XMC4400
XMC4000 Family
General Device Information
VAREF VAGND
VDDA VSSA VDDC VDDP VSS
(1) (1) (4) (4) (1)
V (1) Exp. Die Pad
BAT (VSS)
RTC_XTAL1 (1) VSSO
RTC_XTAL2
Port 0
HIB_IO_0 12 bit
Port 1
9 bit
XTAL1
XTAL2 Port 2
10 bit
USB_DP
USB_DM
VBUS
Port 14
9 bit
PORST TCK JTAG SWD
3 bit 1 bit
TMS via Port Pins
Figure 3 XMC4400 Logic Symbol PG-LQFP-64 and PG-TQFP-64
Data Sheet 16 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page17
2.2 Pin Configuration and Definition
XMC4400
XMC4000 Family
General Device Information
2.2 Pin Configuration and Definition
The following figures summarize all pins, showing their locations on the different
packages.
P0.1 1 75 P1.4
P0.0 2 74 P1.5
P0.10 3 73 P1.10
P0.9 4 72 P1.11
P3.2 5 71 P1.12
P3.1 6 70 P1.13
P3.0 7 69 P1.14
USB_DM 8 68 P1.15
USB_DP 9 67 TCK
VBUS 10 66 TMS
VDDP 11 65 PORST
VDDC 12
HIB_IO_1 13 XMC4400 64 VDDC
63 VSSO
HIB_IO_0 14 62 XTAL2
RTC_XTAL1 15 (Top View) 61 XTAL1
RTC_XTAL2 16 60 VDDP
VBAT 17 59 VSS
P15.3 18 58 P5.0
P15.2 19 57 P5.1
P14.15 20 56 P5.2
P14.14 21 55 P5.7
P14.13 22 54 P2.6
P14.12 23 53 P2.7
P14.7 24 52 P2.0
P14.6 25 51 P2.1
Figure 4 XMC4400 PG-LQFP-100 Pin Configuration (top view)
Data Sheet 17 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
P14.5 26 100 P0.2
P14.4 27 99 P0.3
P14.3 28 98 P0.4
P14.2 29 97 P0.5
P14.1 30 96 P0.6
P14.0 31 95 P0.11
VAGND 32 94 P0.12
VAREF 33 93 P3.3
VSSA 34 92 P3.4
VDDA 35 91 P3.5
P14.9 36 90 P3.6
P14.8 37 89 P0.7
P15.9 38 88 P0.8
P15.8 39 87 VDDP
P2.15 40 86 VDDC
P2.14 41 85 P4.0
VDDC 42 84 P4.1
VDDP 43 83 P1.6
P2.10 44 82 P1.7
P2.9 45 81 P1.8
P2.8 46 80 P1.9
P2.5 47 79 P1.0
P2.4 48 78 P1.1
P2.3 49 77 P1.2
P2.2 50 76 P1.3
Page18
XMC4400
XMC4000 Family
General Device Information
P0.1 1 48 P1.4
P0.0 2 47 P1.5
P0.10 3 46 P1.15
P0.9 4 45 TCK
USB_DM 5 44 TMS
USB_DP 6 43 PORST
VBUS 7 42 VDDC
VDDP 8 XMC4400 41 VSSO
VDDC 9 40 XTAL2
HIB_IO_0 10 (Top View) 39 XTAL1
RTC_XTAL1 11 38 VDDP
RTC_XTAL2 12 37 VSS
VBAT 13 36 P2.6
P14.14 14 35 P2.7
P14.7 15 34 P2.0
P14.6 16 33 P2.1
Figure 5 XMC4400 PG-LQFP-64 and PG-TQFP-64 Pin Configuration (top view)
Data Sheet 18 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
P14.5 17 64 P0.2
P14.4 18 63 P0.3
P14.3 19 62 P0.4
P14.0 20 61 P0.5
VAGND 21 60 P0.6
VAREF 22 59 P0.11
P14.9 23 58 P0.7
P14.8 24 57 P0.8
VDDC 25 56 VDDP
VDDP 26 55 VDDC
P2.9 27 54 P1.8
P2.8 28 53 P1.9
P2.5 29 52 P1.0
P2.4 30 51 P1.1
P2.3 31 50 P1.2
P2.2 32 49 P1.3
Page19
2.2.1 Package Pin Summary
XMC4400
XMC4000 Family
General Device Information
2.2.1 Package Pin Summary
The following general scheme is used to describe each pin:
Table 9 Package Pin Mapping Description
Function Package A Package B ... Pad Notes
Type
Name N Ax ... A2
The table is sorted by the “Function” column, starting with the regular Port pins (Px.y),
followed by the dedicated pins (i.e. PORST) and supply pins.
The following columns, titled with the supported package variants, lists the package pin
number to which the respective function is mapped in that package.
The “Pad Type” indicates the employed pad type (A1, A1+, A2, special=special pad,
In=input pad, AN/DIG_IN=analog and digital input, Power=power supply). Details about
the pad properties are defined in the Electrical Parameters.
In the “Notes”, special information to the respective pin/function is given, i.e. deviations
from the default configuration after reset. Per default the regular Port pins are configured
as direct input with no internal pull device active.
Table 10 Package Pin Mapping
Function LQFP-100 LQFP-64 Pad Type Notes
TQFP-64
P0.0 2 2 A1+
P0.1 1 1 A1+
P0.2 100 64 A2
P0.3 99 63 A2
P0.4 98 62 A2
P0.5 97 61 A2
P0.6 96 60 A2
P0.7 89 58 A2 After a system reset, via
HWSEL this pin selects the
DB.TDI function.
P0.8 88 57 A2 After a system reset, via
HWSEL this pin selects the
DB.TRST function, with a
weak pull-down active.
P0.9 4 4 A2
P0.10 3 3 A1+
Data Sheet 19 V1.3, 2018-09
Subject to Agreement on the Use of Product Information
Page20
XMC4400
XMC4000 Family
General Device Information
Table 10 Package Pin Mapping (cont’d)
Function LQFP-100 LQFP-64 Pad Type Notes
TQFP-64
P0.11 95 59 A1+
P0.12 94 - A1+
P1.0 79 52 A1+
P1.1 78 51 A1+
P1.2 77 50 A2
P1.3 76 49 A2
P1.4 75 48 A1+
P1.5 74 47 A1+
P1.6 83 - A2
P1.7 82 - A2
P1.8 81 54 A2
P1.9 80 53 A2
P1.10 73 - A1+
P1.11 72 - A1+
P1.12 71 - A2
P1.13 70 - A2
P1.14 69 - A2
P1.15 68 46 A2
P2.0 52 34 A2
P2.1 51 33 A2 After a system reset, via
HWSEL this pin selects the
DB.TDO function.
P2.2 50 32 A2
P2.3 49 31 A2
P2.4 48 30 A2
P2.5 47 29 A2
P2.6 54 36 A1+
P2.7 53 35 A1+
P2.8 46 28 A2
P2.9 45 27 A2
P2.10 44 - A2
P2.14 41 - A2
P2.15 40 - A2
Data Sheet 20 V1.3, 2018-09
Subject to Agreement on the Use of Product Information