Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Overview The KEMET Automotive Grade High Voltage surface Whether underhood or in-cabin, these capacitors are mount MLCCs in X7R dielectric feature a 125°C designed to provide reliable performance in mission maximum operating temperature and are considered and safety critical automotive circuits. Stricter testing “temperature stable.” The Electronics Industries Alliance protocol and inspection criteria have been established for (EIA) characterizes X7R dielectric as a Class II material. automotive grade products in recognition of potentially harsh Components of this classification are fixed, ceramic environmental conditions. KEMET automotive grade series dielectric capacitors suited for bypass and decoupling capacitors meet the demanding Automotive Electronics applications or for frequency discriminating circuits, Council's AEC-Q200 qualification requirements. where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C. Available in a variety of case sizes and industry leading CV values (capacitance/voltage), these devices exhibit low leakage current and low ESR at high frequencies. Conventional uses include both snubbers and filters in applications such as switching power supplies and lighting ballasts. Their exceptional performance at high frequencies has made high voltage MLCC's the preferred dielectric choice of design engineers worldwide. In addition to their use in power supplies, these capacitors are widely used in industries related to automotive (hybrid), telecommunications, medical, military, aerospace, semiconductors and test/diagnostic equipment. Ordering Information C 1210 C 154 K C R A C AUTO Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Rate/ Packaging/Grade Ceramic Dielectric Termination Finish1 (L" x W") Series Code (pF) Tolerance (VDC) Design (C-Spec) 0603 C = Standard Two J = ±5% C = 500 R = X7R A = N/A C = 100% Matte Sn See "Packaging 0805 significant K = ±10% B = 630 C-Spec Ordering 1206 digits and M = ±20% D = 1,000 Options Table" 1210 number of F = 1,500 1808 zeros. G = 2,000 1812 Z = 2,500 1825 H = 3,000 2220 2225 1 Additional termination finish options may be available. Contact KEMET for details. Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Packaging C-Spec Ordering Options Table Packaging Type1 Packaging/Grade Ordering Code (C-Spec)3 7" Reel AUTO 13" Reel/Unmarked AUTO7411 (EIA 0603 and smaller case sizes) AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information." 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." 3 All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking." 3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." Benefits • AEC-Q200 automotive qualified • DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV, • −55°C to +125°C operating temperature range 2.5 KV, and 3 KV • Industry-leading CV values • Capacitance offerings ranging from 10 pF to 560 nF • Exceptional performance at high frequencies • Available capacitance tolerances of ±5%, ±10%, and ±20% • Lead (Pb)-free, RoHS and REACH compliant • Low ESR and ESL • EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, • Non-polar device, minimizing installation concerns and 2225 case sizes • 100% pure matte tin-plated termination finish allowing for excellent solderability Applications Typical applications include switch mode power supplies (input filters, resonators, tank circuits, snubber circuits, output filters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk converters. Markets include power supply, LCD fluorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive (electric and hybrid vehicles, charging stations and lighting applications). Application Note X7R dielectric is not recommended for AC line filtering or pulse applications. These capacitors and/or the assembled circuit board containing these capacitors may require a protective surface coating to prevent external surface arcing. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 2 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notifi cation (PCN) The KEMET product change notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation Due To: Days Prior To C-Spec Process/Product change Obsolescence* Implementation KEMET assigned1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 3 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Dimensions – Millimeters (Inches) W L T B S EIA Size Metric Size L W S T Thickness B Separation Mounting Code Code Length Width Bandwidth Minimum Technique 0603 1608 1.60 (0.063) 0.80 (0.032) 0.35 (0.014) ±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006) 0.70 (0.028) 0805 2012 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 0.75 (0.030) Solder wave or ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder reflow 1206 3216 3.20 (0.126) 1.60 (0.063) 0.50 (0.02) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) 1210 3225 3.20 (0.126) 2.50 (0.098) 0.50 (0.02) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) 1808 4520 4.70 (0.185) 2.00 (0.079) See Table 2 for 0.60 (0.024) ±0.50 (0.020) ±0.20 (0.008) Thickness ±0.35 (0.014) 1812 4532 4.50 (0.177) 3.20 (0.126) 0.60 (0.024) ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) N/A Solder reflow 4.50 (0.177) 6.40 (0.252) 0.60 (0.024) only 1825 4564 ±0.30 (0.012) ±0.40 (0.016) ±0.35 (0.014) 2220 5650 5.70 (0.224) 5.00 (0.197) 0.60 (0.024) ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) 2225 5664 5.60 (0.220) 6.40 (0.248) 0.60 (0.024) ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) Qualification/Certification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 4 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC) ±15% 1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 150% of rated voltage for voltage rating of < 1,000 V 2Dielectric Withstanding Voltage (DWV) 120% of rated voltage for voltage rating of ≥ 1,000 V (5 ±1 seconds and charge/discharge not exceeding 50 mA) 3Dissipation Factor (DF) Maximum Limit at 25°C 2.5% 4Insulation Resistance (IR) Minimum Limit at 25°C See Insulation Resistance Limit Table (500 VDC applied for 120 ±5 seconds at 25°C) 1 Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 12 0Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Capacitance Dissipation Factor Capacitance Insulation Voltage Value (Maximum %) Shift Resistance > 25 3.0 X7R 16/25 All 5.0 ±20% 10% of Initial limit < 16 7.5 Insulation Resistance Limit Table (X7R Dielectric) EIA Case Size 1,000 Megohm 100 Megohm Microfarads or 100 GΩ Microfarads or 10 GΩ 0603 N/A All 0805 < 0.0039 µF ≥ .0039 µF 1206 < 0.012 µF ≥ 0.012 µF 1210 < 0.033 µF ≥ 0.033 µF 1808 < 0.018 µF ≥ 0.018 µF 1812 < 0.027 µF ≥ 0.027 µF 1825 < 0.120 µF ≥ 0.120 µF 2220 < 0.150 µF ≥ 0.150 µF 2225 < 0.180 µF ≥ 0.180 µF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 5 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) Case Size/ Series C0603C C0805C C1206C C1210C C1808C C1812C2 Cap Cap Voltage Code C B D C B D C B D F G C B D F G C B D F G Z H C B D F G Z H Code Rated Voltage (VDC) Capacitance Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 10 pF 100 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 11 pF 110 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 12 pF 120 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 13 pF 130 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 15 pF 150 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 16 pF 160 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 18 pF 180 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 20 pF 200 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 22 pF 220 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 24 pF 240 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 27 pF 270 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 30 pF 300 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 33 pF 330 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 36 pF 360 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 39 pF 390 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 43 pF 430 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 47 pF 470 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 51 pF 510 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 56 pF 560 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 62 pF 620 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 68 pF 680 J K M DG DG DG ED ED ED ED ED FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 75 pF 750 J K M DG DG DG ED ED ED ED EF FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 82 pF 820 J K M DG DG DG ED ED ED ED EF FM FM FM FM FM LB LB LB LB LB LB LB GB GB GB GB GB GB GB 91 pF 910 J K M DG DG DG ED ED ED ED EF FM FM FM FM FM LB LB LB LB LB LB LB GD GD GD GD GD GD GD 100 pF 101 J K M DG DG DG ED ED ED ED EF FM FM FM FM FM LB LB LB LB LB LC LB GD GD GD GD GD GD GD 110 pF 111 J K M DG DG DG ED ED ED ED EG FM FM FM FM FM LB LB LB LB LB LC LB GD GD GD GD GD GD GD 120 pF 121 J K M DG DG DG ED ED ED ED EG FM FM FM FM FM LA LA LA LA LB LC LB GD GD GD GD GD GD GD 130 pF 131 J K M DG DG DG ED ED ED ED EG FG FG FG FM FM LA LA LA LA LB LC LB GD GD GD GD GD GD GD 150 pF 151 J K M DG DG DG ED ED ED EF EG FG FG FG FM FM LA LA LA LA LB LC LB GD GD GD GD GD GD GK 180 pF 181 J K M DG DG DG ED ED ED EF EG FG FG FG FM FM LA LA LA LA LC LC LB GD GD GD GD GD GD GK 220 pF 221 J K M DG DG DG ED ED ED EG EG FG FG FG FM FM LA LA LA LA LC LC LB GB GB GB GB GB GD GB 270 pF 271 J K M DG DG DG ED ED ED EG EG FG FG FG FK FK LA LA LA LB LC LC LC GB GB GB GB GB GH GB 330 pF 331 J K M DG DG DG ED ED EF EG EG FG FG FG FK FK LA LA LA LB LC LC LC GB GB GB GB GB GH GB 390 pF 391 J K M DG DG DG ED ED EF EG EG FG FG FG FK FS LA LA LA LB LB LB LC GB GB GB GB GD GK GH 470 pF 471 J K M DG DG DG ED ED EG EF EG FG FM FM FS FS LA LB LB LC LB LB LC GB GB GB GB GD GK GH 560 pF 561 J K M DG DG DG ED ED EG EF EG FG FM FM FS FL LA LB LB LC LB LB LC GB GB GB GD GH GH GK 680 pF 681 J K M DG DG DG ED ED EG EF EG FG FM FM FS FL LB LB LB LA LB LC LC GB GB GB GD GH GH GK 820 pF 821 J K M DG DG DG ED ED ED EF EG FG FM FM FL FL LB LB LB LA LB LC LC GB GB GB GD GH GH GK 1,000 pF 102 J K M CG CG CG DG DG DG ED ED ED EF EG FM FM FM FL FL LB LB LB LA LB LC LC GB GB GB GB GH GH GK 1,200 pF 122 J K M CG CG DG DG DG ED ED ED EG EG FM FK FK FL FM LC LC LC LB LC LA GB GB GB GB GH GK GK 1,500 pF 152 J K M CG CG DG DG DG ED ED ED EG EG FK FS FS FL FM LC LC LC LB LC LB GB GB GB GB GH GK 1,800 pF 182 J K M CG DG DG DG ED ED ED EG EG FK FS FS FL FM LC LC LC LB LC LC GB GD GD GB GH GK 2,200 pF 222 J K M CG DG DG DG ED ED ED EG EG FK FL FL FL FM LC LA LA LB LC LC GB GH GH GB GH GK 2,700 pF 272 J K M CG DG DG DG ED ED ED EG FS FL FL FL FM LC LA LA LB LC GB GB GB GH GK GM 3,300 pF 332 J K M CG DG DG DG ED ED ED EG FS FL FL FL FM LA LA LA LB LA GB GB GB GH GK GM 3,900 pF 392 J K M CG DG DG DG ED ED ED EG FL FL FL FL FK LA LA LA LB LB GB GB GB GH GM GO 4,700 pF 472 J K M DG DG DG ED ED ED EG FL FL FL FL FK LA LA LA LB LC GH GH GH GH GH GO 5,600 pF 562 J K M DG DG ED EF EF EF FL FL FL FM FK LA LB LB LC GH GH GH GK GK 6,800 pF 682 J K M DG DG EF EF EF EF FL FL FL FM FS LA LB LB LC GH GH GH GK GM 8,200 pF 822 J K M DG DG EF EG EG EF FL FL FL FK LA LB LB LC GH GH GH GK GM 10,000 pF 103 J K M DG DG EF EG EG EG FL FL FL FK LA LB LB LC GH GH GH GK GO 12,000 pF 123 J K M DG DG EG EJ EJ FL FL FL FK LA LC LC LB GB GK GK GK Rated Voltage (VDC) Cap Cap Code Voltage Code C B D C B D C B D F G C B D F G C B D F G Z H C B D F G Z H Case Size/ Series C0603C C0805C C1206C C1210C C1808C C1812C2 KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). 2 Available capacitance values available in X7R with KONNEKT Technology. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 6 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 500 500 630 630 1000 1000 500 500 630 630 1000 1000 500 500 630 630 1000 1000 1500 1500 2000 2000 500 500 630 630 1000 1000 1500 1500 2000 2000 500 500 630 630 1000 1000 1500 1500 2000 2000 2500 2500 3000 3000 500 500 630 630 1000 1000 1500 1500 2000 2000 2500 2500 3000 3000

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) cont. Case Size/ Series C0603C C0805C C1206C C1210C C1808C C1812C2 Cap Cap Voltage Code C B D C B D C B D F G C B D F G C B D F G Z H C B D F G Z H Code Rated Voltage (VDC) Capacitance Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 15,000 pF 153 J K M DG EG EJ EJ FL FL FL FL LA LC LC LC GB GK GK GH 18,000 pF 183 J K M DG EJ EJ EJ FL FL FL FM LA LE LE GB GK GK GM 22,000 pF 223 J K M DG EJ EJ EJ FL FM FM FM LA LE LE GB GK GK GM 27,000 pF 273 J K M EJ EJ FM FK FK FK LA LA LA GH GB GB GO 33,000 pF 333 J K M EJ EJ FM FG FH FS LC LA LA GH GB GB GO 39,000 pF 393 J K M EJ FK FG FH FS LC LA LA GH GB GB 47,000 pF 473 J K M EJ FK FH FK LC LA LB GH GB GC 56,000 pF 563 J K M EJ FG FH FK LC LA LB GH GB GE 68,000 pF 683 J K M EJ FG FK FS LA LA LC GE GE GE 82,000 pF 823 J K M FH FK LA LC GB GE GK 0.10 µF 104 J K M FK FS LA LC GB GH GJ 0.12 µF 124 J K M FK LA GE GK 0.15 µF 154 J K M FK LB GE GN 0.18 µF 184 J K M GF 0.22 µF 224 J K M GJ 0.27 µF 274 J K M GL 0.33 µF 334 J K M GS Rated Voltage (VDC) Cap Cap Code Voltage Code C B D C B D C B D F G C B D F G C B D F G Z H C B D F G Z H Case Size/ Series C0603C C0805C C1206C C1210C C1808C C1812C2 Table 1B – Capacitance Range/Selection Waterfall (1825–2225 Case Sizes) Case Size/ Series C1825C C2220C C2225C Capacitance Cap Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H Code Rated Voltage (VDC) Capacitance Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions 100 pF 101 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 110 pF 111 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 120 pF 121 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 130 pF 131 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 150 pF 151 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 180 pF 181 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 220 pF 221 J K M HE HE HE HE HE HE HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF 270 pF 271 J K M HE HE HE HE HE HE HG JK JK JK JK JK JK JK KE KE KE KE KE KE KF 330 pF 331 J K M JE JE JE JE JE JK JK KE KE KE KE KE KE KF 390 pF 391 J K M JE JE JE JE JE JK JK KE KE KE KE KE KE KF 470 pF 471 J K M HG HG HG HG HG HG HG JE JE JE JE JE JK JK KF KF KF KF KE KE KF 560 pF 561 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KE KE KF 680 pF 681 J K M HG HG HG HG HG HG HG JE JE JE JK JK JK JK KF KF KF KF KE KF KF 820 pF 821 J K M HG HG HG HG HG HG HG JE JE JE JK JK JK JK KE KE KE KF KE KF KF Rated Voltage (VDC) Capacitance Cap Code Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H Case Size/Series C1825C C2220C C2225C KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). 2 Available capacitance values available in X7R with KONNEKT Technology. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 7 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 500 500 630 630 1000 1000 500 500 500 500 630 630 630 630 1000 1000 1000 1000 500 500 630 630 1500 1500 1000 1000 2000 2000 1500 1500 2500 2500 2000 2000 3000 3000 500 500 630 630 500 500 1000 1000 630 630 1500 1500 1000 1000 2000 2000 1500 1500 500 500 630 630 2000 2000 1000 1000 2500 2500 1500 1500 3000 3000 2000 2000 500 500 2500 2500 3000 3000 630 630 500 500 1000 1000 630 630 1500 1500 1000 1000 1500 1500 2000 2000 2000 2000 2500 2500 2500 2500 3000 3000 3000 3000

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes) cont. Case Size/ Series C1825C C2220C C2225C Capacitance Cap Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H Code Rated Voltage (VDC) Capacitance Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions 1,000 pF 102 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KE KF KF 1,200 pF 122 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF 1,500 pF 152 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF 1,800 pF 182 J K M HE HE HE HE HE HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF 2,200 pF 222 J K M HE HE HE HE HE HG HG JE JK JK JE JE JK JK KF KE KE KF KF KF KF 2,700 pF 272 J K M HE HE HE HE HE HG JK JK JK JE JE JK JK KE KE KE KE KE KF KE 3,300 pF 332 J K M HE HE HE HE HE HG JK JK JK JE JE JK JE KE KE KE KE KE KF KE 3,900 pF 392 J K M HE HE HE HE HE HG JK JK JK JE JE JK JE KE KF KF KE KE KF KE 4,700 pF 472 J K M HE HE HE HE HE HG JK JK JK JE JK JE JE KE KF KF KE KE KF KE 5,600 pF 562 J K M HE HE HE HE HE HG JK JK JK JE JK JE JE KE KF KF KE KE KF KE 6,800 pF 682 J K M HE HE HE HE HE HJ JK JE JE JE JK JE JE KE KF KF KE KF KE KE 8,200 pF 822 J K M HE HE HE HE HE HJ JK JE JE JE JK JK JK KF KE KE KE KF KF KF 10,000 pF 103 J K M HE HE HE HE HJ HK JE JE JE JE JL JL JL KF KE KE KE KF KH KH 12,000 pF 123 J K M HE HE HE HG HJ JE JK JK JK JL JL JL KE KE KE KE KF KH KH 15,000 pF 153 J K M HE HE HE HG HK JE JK JK JK JL JN JN KE KE KE KE KF KJ KJ 18,000 pF 183 J K M HE HE HE HG JE JK JK JK JN KE KE KE KE KH 22,000 pF 223 J K M HE HG HG HG JE JK JK JK JN KE KF KF KF KJ 27,000 pF 273 J K M HE HG HG HG JE JK JK JK KE KF KF KF KJ 33,000 pF 333 J K M HE HG HG HE JE JK JK JK KE KF KF KF 39,000 pF 393 J K M HE HG HG HG JE JK JK JE KE KF KF KF 47,000 pF 473 J K M HE HG HG HJ JE JK JK JK KE KF KF KF 56,000 pF 563 J K M HE HG HG HJ JE JE JE JL KE KF KF KF 68,000 pF 683 J K M HG HJ HJ HK JE JK JK JL KE KF KF KJ 82,000 pF 823 J K M HG HJ HJ JE JL JL JN KE KF KF KJ 0.10 µF 104 J K M HG HK HK JE JN JN KE KH KH KJ 0.12 µF 124 J K M HG HE JE JN JN KE KH KH 0.15 µF 154 J K M HG HE JK JE KF KJ KJ 0.18 µF 184 J K M HG HG JK JE KF KE 0.22 µF 224 J K M HG HJ JK JK KF KF 0.27 µF 274 J K M HJ HJ JK JL KF KH 0.33 µF 334 J K M HJ JL JN KF KH 0.39 µF 394 J K M HK JN KH KJ 0.47 µF 474 J K M JN KH KJ 0.56 µF 564 J K M KJ 0.56 µF 564 J K M Rated Voltage (VDC) Capacitance Cap Code Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H Case Size/Series C1825C C2220C C2225C KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 8 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 500 500 630 630 1000 1000 1500 1500 2000 2000 2500 2500 3000 3000 500 500 630 630 1000 1000 1500 1500 2000 2000 2500 2500 3000 3000 500 500 630 630 1000 1000 1500 1500 2000 2000 2500 2500 3000 3000

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CG 0603 0.80 ± 0.10* 4,000 15,000 0 0 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 ED 1206 1.00 ± 0.10 0 0 2,500 10,000 EF 1206 1.20 ± 0.15 0 0 2,500 10,000 EG 1206 1.60 ± 0.15 0 0 2,000 8,000 EJ 1206 1.70 ± 0.20 0 0 2,000 8,000 FG 1210 1.25 ± 0.15 0 0 2,500 10,000 FL 1210 1.40 ± 0.15 0 0 2,000 8,000 FH 1210 1.55 ± 0.15 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FK 1210 2.10 ± 0.20 0 0 2,000 8,000 FS 1210 2.50 ± 0.30 0 0 1,000 4,000 LE 1808 1.00 ± 0.10 0 0 2,500 10,000 LA 1808 1.40 ± 0.15 0 0 1,000 4,000 LB 1808 1.60 ± 0.15 0 0 1,000 4,000 LC 1808 2.00 ± 0.15 0 0 1,000 4,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GC 1812 1.10 ± 0.10 0 0 1,000 4,000 GE 1812 1.30 ± 0.10 0 0 1,000 4,000 GH 1812 1.40 ± 0.15 0 0 1,000 4,000 GF 1812 1.50 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GJ 1812 1.70 ± 0.15 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GL 1812 1.90 ± 0.20 0 0 500 2,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 GS 1812 2.10 ± 0.20 0 0 500 2,000 GO 1812 2.50 ± 0.20 0 0 500 2,000 HE 1825 1.40 ± 0.15 0 0 1,000 4,000 HG 1825 1.60 ± 0.20 0 0 1,000 4,000 HJ 1825 2.00 ± 0.20 0 0 500 2,000 HK 1825 2.50 ± 0.20 0 0 500 2,000 JE 2220 1.40 ± 0.15 0 0 1,000 4,000 JK 2220 1.60 ± 0.20 0 0 1,000 4,000 JL 2220 2.00 ± 0.20 0 0 500 2,000 JN 2220 2.50 ± 0.20 0 0 500 2,000 KE 2225 1.40 ± 0.15 0 0 1,000 4,000 KF 2225 1.60 ± 0.20 0 0 1,000 4,000 KH 2225 2.00 ± 0.20 0 0 500 2,000 KJ 2225 2.50 ± 0.20 0 0 500 2,000 Thickness Case Thickness ± 7" Reel 13" Reel 7" Reel 13" Reel Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 9 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 1.50 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 10 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish Profile Feature TP Maximum Ramp-up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second T Preheat/Soak L tL Temperature Minimum (TSmin) 100°C 150°C Tsmax Temperature Maximum (TSmax) 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds Tsmin ts Ramp-Up Rate (T to T ) 3°C/second 3°C/second L P maximum maximum 25 Liquidous Temperature (TL) 183°C 217°C 25°C to Peak Time Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (tP) maximum maximum Ramp-Down Rate (TP to T ) 6°C/second 6°C/second L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 11 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Temperature

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Construction Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer Dielectric (Ni) Material (BaTiO3) Termination Finish End Termination/ (100% Matte Sn) External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 12 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Capacitor Marking (Optional) These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”, marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional. the correct ordering code identifi er(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited 2-Digit to the “K” character only. KEMET ID Capacitance Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with fl exible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 1608 ≤ 170 pF 0805 2012 ≤ 150 pF 1206 3216 ≤ 910 pF 1210 3225 ≤ 2,000 pF 1808 4520 ≤ 3,900 pF 1812 4532 ≤ 6,700 pF 1825 4564 ≤ 0.018 µF 2220 5650 ≤ 0.027 µF 2225 5664 ≤ 0.033 µF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 13 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Capacitor Marking (Optional) cont. Capacitance (pF) For Various Alpha/Numeral Identifi ers Alpha Numeral 9 0 1 2 3 4 5 6 7 8 Character Capacitance (pF) A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 14 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® ET Embossed plastic* or KEM punched paper carrier. Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape Anti-static cover tape 180 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) Tape Embossed Plastic Punched Paper New 2 mm Pitch Reel Options* EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Packaging (W)* Ordering Code Packaging Type/Options Pitch (P1)* Pitch (P1)* (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 16 12 12 • Double the parts on each reel results in fewer reel and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. storage costs, reducing waste. *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 15 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P2 T ØD P (10 pitches cumulative 2 E 0 0 tolerance on tape ±0.2 mm) 1 A0 F K0 W B1 B E 0 2 S1 P1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1 Table 4 B1 is for tape feeder reference only, including draft concentric about B0. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D D1 Minimum E P P R Reference S1 Minimum T T1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 8 mm 1.0 25.0 (0.039) (0.984) 12 mm 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) Tape Size Pitch B1 Maximum E2 T2 W Note 4 Minimum F P1 Maximum Maximum A0,B0 & K0 8 mm Single (4 mm) 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) 12 mm Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) Note 5 16 mm Triple (12 mm) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 16 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po (10 pitches cumulative ØDo E tolerance on tape ±0.2 mm) 1 A0 F W E Bottom Cover Tape B0 2 T1 P1 G T1 Cavity Size, Top Cover Tape Center Lines of Cavity See Note 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum R Reference Note 2 8 mm 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.10 0.75 25 (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.004) maximum (0.030) (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0 8 mm Half (2 mm) 2.0 ±0.05 8.3 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 8 mm Single (4 mm) (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 (0.157 ±0.004) (0.327) 1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 17 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( ° ) s T Bo 8,12 20 16 – 200 10 Tape Maximum Width (mm) Rotation ( ° S) 8,12 20 Typical Component Centerline 16 – 56 10 Ao 72 – 200 5 Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 18 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 6 – Reel Dimensions Full Radius, Access Hole at W3 (Includes See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W2 (Measured at hub) A D (See Note) N C (Arbor hole W1 (Measured at hub) diameter) If present, tape slot in core for tape start: 2.5 mm minimum width x B 10.0 mm minimum depth (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 12 mm or 1.5 13.0 +0.5/−0.2 20.2 330 ±0.20 (0.059) (0.521 +0.02/−0.008) (0.795) 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 8 mm 8.4 +1.5/−0.0 14.4 (0.331 +0.059/−0.0) (0.567) 12 mm 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16 mm 16.4 +2.0/−0.0 22.4 (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 19 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum leader Trailer 160 mm minimum Components 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1076_X7R_HV_AUTO_SMD • 8/19/2020 20 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com