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ファンレス組込みPC ADLINK MXC-2300シリーズ

製品カタログ

車載/工場・ビルオートメーション/デジタルサイネージ向け組込みPC

特長
■幅142×高さ210×奥行219mm 6.53リットル
■Atom E3845 1.91GHz 4 cores CPU
■ファンレス動作
■堅牢、耐振動、ケーブルレス構造
■拡張スロット 2PCI + 1PCIe[x1] / 3PCI
■DVI-I + DisplayPort
■Isolated 2CAN+16DI+16DO(MXC-2300CD)
■動作温度 -20~70℃(拡張温度オプション)
■ワイドDC入力 9V~32V
仕様
■CPU Atom E3845 1.91GHz, 4 cores
■チップセット SoC (System on Chip)
■メモリ 4GB DDR3L 1333MHz SODIMM, 2ソケット最大 8GB
■拡張スロット
 PCI x 2, PCIe[x4] x 1(MXC-2300CD-3EI) , PCI x 3(MXC-2300CD-3S), PCI x 2, PCIe[x4] x 1(MXC-2300-3EI), PCI x 3(MXC-2300-3S)
 タイプIIコンパクトフラッシュ x 1
■I/Oコネクタ
 GbE x 2
 USB2.0 x 4 & USB3.0 x 1
 RS-232 x 2(D-Sub9), RS-232/422/485 x 2(D-Sub9)
 オーディオ Mic in , Line out
 DVI-I (VGA+DVI) x 1, Display port x 1
■入力電源 DC 9-32V入力
■動作温度 0~50℃
■寸法 / 重量 142mm(W) x 210mm(H) x 219mm(D) / 3.5kg

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ドキュメント名 ファンレス組込みPC ADLINK MXC-2300シリーズ
ドキュメント種別 製品カタログ
ファイルサイズ 345.1Kb
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取り扱い企業 サンテックス株式会社 (この企業の取り扱いカタログ一覧)

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Page1

MXC-2300 Series Intel® Atom™ Quad-Core Processor-based Fanless Expandable Embedded Computer with PCI/PCIe Slots Introduction Featuring the latest Intel® Atom™ E3845 processor (Formerly Bay Trail), the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost- efficiency over any previous generation Atom-based system. Features include dual-port CAN connectivity supported by a Philips SJA1000 controller that can run independently or bridged at the same time, bus arbitration and error detection with auto correction and re-transmission capability, and 16-CH isolated DI/O for general industrial control. An increased total 3PCI/PCIe expansion slot count allows installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications, and an internal PCI Express Mini Card socket and USIM slot support extension of additional functions, such as wireless connection. In addition, the MXC-2300 series offers one DisplayPort and one DVI-I port for dual independent display with full HD, four USB 2.0 and one USB 3.0 ports, and 2 GbE LAN ports with teaming function. Features With ADLINK’s proprietary SEMA (Smart Embedded Management Agent) tool, the MXC-2300 maximizes ■ Intel® Atom™ E3845 processor with 4 core @1.91 GHz SoC manageability and security for a world of applications. Provide efficient remote monitoring of system activity ■ 2x DDR3L SO-DIMM, supporting up to 8 GB memory and health in real time, system control over a robust secured channel, and fully manageable complete utilization of system resources. ■ 2 PCI + 1 PCIe x4 or 3 PCI expansion slots ■ Built-in dual-port isolated CAN and 16-CH isolated DI and DO With its ruggedized architecture, flexibility, and rich I/O capacity, the MXC-2300’s minimal power ■ 1 DisplayPort + 1 DVI-I consumption, abundant features, and leading performance and cost-efficiency make it the embedded ■ 2 Intel GbE ports with teaming function, 1 USB 3.0 + 4 USB 2.0 ports system of choice for industrial automation, facility management, and intelligent transportation systems and applications demanding reliability in harsh environments. ■ 1 external CF slot and 1 internal PCIe Mini Card socket with USIM socket ■ 2 software-programmable RS-232/422/485 + 2 RS-232 ports ■ Built-in 9 to 32 VDC wide-range DC power input ■ Rugged, -20°C to 70°C Fanless operation (w/ industrial SSD) ■ Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent) ■ MXC-2300 Series Front Panel ■ Inside of the MXC-2300(CD)-3E1 Applications 16-CH DI and ■ Machine Automation/Factory Automation 16-CH DO ■ Maritime Automation CAN ■ Intelligent Transportation System/ Surveillance GbE Port x2 CF ■ Test Instrumentation PCI Slot USB 2.0 x4 PCI SlotDVI-I PCIe x4 Slot COM Port x 4 DisplayPort USB 3.0 MIC-In & Line-Out Software Support ■ OS Information DC Input (9-32 V) Recommended expansion slot configuration • Windows® 8/Windows® 8 Embedded options for MXC-2300: 2 PCI + 1 PCIe x4 or 3 PCI expansion slots • Windows® 7/ Windows® 7 Embedded • Linux* Fedora 18 *Linux Distribution by request *Extending the operating temperature is optional and requires use of an industrial solid-state drive storage device. Heat dissipation from inserted PCI/PCIe cards may affect thermal performance.
Page2

Specifications Model Name MXC-2300CD-3E1 MXC-2300CD-3S MXC-2300-3E1 MXC-2300-3S System Core ■ Processor Intel® Atom™ Processor E3845 Processor, 1.91 GHz, 4 cores; 542/792 MHz graphics frequency (Base/Turbo) ■ Chipset Intel SoC (System on Chip) ■ Video DisplayPort: resolution up to 2560x1600 VGA: resolution up to 2560x1600 DVI: resolution up to 1920x1200 ■ Memory 4GB DDR3L 1333 MHz SODIMM module, (up to 8 GB with 2 SODIMM sockets) I/O Interface ■ Expansion slots 2 PCI+1 PCIe x4 3 PCI 2 PCI+1 PCIe x4 3 PCI ■ Ethernet 2 Intel® GbE ports (Intel® Springville WGI210IT chipset) Teaming function, Wake On LAN ■ Serial Ports 2 software-programmable RS-232/422/485 (COM 1&2) with auto-flow control, 2 RS-232 (COM 3&4) ■ USB 5 external USB ports (4 USB 2.0 + 1 USB 3.0) + 1 internal USB 2 .0 ■ CAN 2 DB9 isolated CAN port with SjA1000 CAN controller - ■ DIO 16-CH DI and 16-CH DO with 1.5KV isolation - ■ Mini PCIe 1 internal mini PCIe card socket - ■ USIM 1 USIM socket for 3G communication - ■ Audio 1 MIC-in and 1 Line-out Manageability ■ WDT Hierarchical WDT supported ■ SEMA SEMA 2.2 (Smart Embedded Management Agent) Power Supply ■ DC Input Built-in 9-32 VDC wide-range DC input pluggable connectors with latch (GND, V-, V+), 2-pin remote power on/off switch ■ AC Input Optional 100 W external AC-DC adapter for AC input Storage Device ■ SATA HDD 1x onboard SATA-II port for 2.5” HDD/SSD installation ■ CompactFlash 1 Type II CF socket CompactFlash socket Mechanical ■ Optional Fan Module Optional fan module for heat dissipation, smart fan control ■ Dimensions 142 (W) x219 (D) x210(H) mm (WxDxH) (5.84” x 8.76” x 8.4) ■ Weight 3.5 kg (7.73 lbs) ■ Mounting Wall-mount kit Environmental ■ Operating Temperature Standard: 0°C to 50°C (32˚F to 122˚F) Extended temperature option*: -20°C to 70°C (-4˚F to 158˚F) (w/industrial SSD or CF) ■ Storage Temperature -40°C to 85°C (-40˚F to 185˚F) (excl. HDD/SDD/CF) ■ Humidity ~95% @ 40°C (104˚F) (non-condensing) ■ Vibration Operating, 5 Grms, 5-500 Hz, 3 axes (w/ CF or SSD) Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD) ■ ESD Contact +/-4 KV and Air +/-8 KV ■ Shock Operating, 50 G, half sine 11 ms duration (w/ CF or SSD) ■ EMC CE and FCC Class A ■ Safety UL/cUL, CB Ordering Information Model Name Description Memory Expansion Slots Mini PCIe CAN DIO MXC-2300CD-3E1 Intel® Atom™ E3845 Fanless computer 4 GB DDR3L 2 PCI+1 PCIe x4 1 2 16-CH MXC-2300CD-3S Intel® Atom™ E3845 Fanless computer 4 GB DDR3L 3 PCI 1 2 16-CH MXC-2300-3E1 Intel® Atom™ E3845 Fanless computer 4 GB DDR3L 2 PCI+1 PCIe x4 - - - MXC-2300-3S Intel® Atom™ E3845 Fanless computer 4 GB DDR3L 3 PCI - - - Optional Accessories MXC-2300 Optional Fan Module Fan module for MXC-2300 series 500 GB HDD Option Factory-installed 500 GB SATA hard disk drive (0˚C to 50˚C, 32˚F to 122˚F) 32/64 GB SSD Option Factory-installed 32/64 GB MLC SATA solid-state drive (0˚C to 70˚C, 32˚F to 158˚F) 32G CF Factory-installed 32 GB industrial Compact Flash (-40˚C to 85˚C, -40˚F to 185˚F) 100 W AC-DC Adapter 100 W industrial grade A C-DC adapter (-20˚C to 70˚C, -4˚F to 158˚F) 90 W AC-DC Adapter 90 W commercial grade AC-DC adapter (0°C to 50°C, 32˚F to 122˚F) Extended Temperature Option* Optional screening service to extend the operating temperature to -20°C to 70°C (-4˚F to 158˚F) *For more options regarding display and COM port cables, please refer to page 1-28. *Updated January 24, 2014. ©2014 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.