1/2ページ
ダウンロード(740.5Kb)
このカタログについて
ドキュメント名 | 産業用PC IEI [TANK-870e-H110] |
---|---|
ドキュメント種別 | 製品カタログ |
ファイルサイズ | 740.5Kb |
登録カテゴリ | |
取り扱い企業 | サンテックス株式会社 (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
Page1
Industrial System
w w w . i e i w o r l d . c o m
TANK-870e-H110 ■ High-Performance 6th/7th Generation Intel® Core™ Processor ■ Fanless Embedded Computer
Features
● 6th/7th Gen Intel® Core™ processor platform with
Intel® H110 chipset and DDR4 memory
● Support dual display VGA+HDMI
● On-board internal power connector for providing power
to add-on cards
● Great flexibility for hardware expansion
DDR4
Fanless 2133 Dual GbE
PCI/PCIe
Expansion
Specifications
Model Name TANK-870e-H110
Color Dark silver purple + Silver
Dimensions (WxDxH) (mm) 132.6 x 255.2 x 190
Chassis
System Fan Fanless
Chassis Construction Extruded aluminum alloys
Intel 7th Gen Core CPU &
CPU Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
Motherboard Chipset Intel® H110
System Memory 2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
Storage Hard Drive 1 x 2.5'' SATA 6Gb/s HDD/SSD bay
USB 3.0 4
Ethernet 2 x RJ-45 PCIe GbE by RTL8111G controller
COM Port 2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
I/O Interfaces Display 1 x VGA, 1 x HDMI 1.4
Resolution VGA: Up to 1920 X 1200@60Hz HDMI 1.4: Up to 4096x2160@24Hz
Audio 1 x Line-out ; 1 x Mic-in
Wireless 1 x 802.11a/b/g/n/ac (optional)
3A: 1 x PCIe x16 , 2 x PCI
Backplane 3B: 1 x PCIe x16 , 1 x PCIe x4, 1 x PCI
Expansions 3C: 3 x PCI
PCIe Mini 1 x Full-size PCIe Mini slot 1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power Input DC Jack: 9 V~36 V DCTerminal Block: 9 V~36 V DC
Power Power Consumption 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Power Connector 5V@3A or 12V@3A
Mounting Wall mount & DIN Rail
Operating Temperature i7-6700TE -20°C ~ 50°C with air flow (SSD), 10% ~ 95%, non-condensingi5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing
Storage Temperature -40ºC ~ 85ºC with air flow (SSD),
5% ~ 90%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis
Reliability
Non-Operating Shock Half-sine wave shock 15G, 11ms, 100 shocks per axis
Operating Vibration MIL-STD-810G 514.6C-1 (with SSD)
Non-Operation Vibration Half-sind mode IEC-60068-2-06
Weight (Net/Gross) 4.2 kg/6.3 kg
Safety/EMC CE/FCC
OS Supported OS Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise
TANK-870e-H110-2018-V13
Page2
Industrial System
w w w . i e i w o r l d . c o m
Versatile Expansion Interface
Backplane 3A HPE-3S6 3B HPE-3S7 3C HPE-3PCI
Slot 2 x PCI 1 x PCIe x16 1 x PCI 1 x PCIe x4 1 x PCIe x16 3 x PCI
Signal PCI PCIe x16 PCI PCIe x1 PCIe x16 PCI
Fully Integrated I/O Dimensions (Unit: mm)
Power Switch
1. Long-press 2 sec. to power on
2. Long-press 5 sec. to power off
2 x RS-232/
422/485 Reset
2 x GbE LAN
4 x USB 3.0 3 x Expansion Slots
VGA
Audio
Power2
(DC Jack) AT/ATX Mode
Power1 TANK-870e-H110
HDMI (Terminal Block)
Ordering Information
Part No. Description
TANK-870e-H110-i5/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory,
1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory,
1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core™ i5-6500TE 2.3 GHz (up to 3.3 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory,
3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory,
1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory,
1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core™ i7-6700TE 2.4 GHz (up to 3.4 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory,
3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
Options
Part No. Description
32702-000400-200-RS European power cord
63040-010120-210-RS Power adapter, FSP120-ABBN2, 9NA1205302, Active PFC, Vin:90~264VAC, 120W, plug=6.5mm, cable=1500mm, Erp (no load 0.15W), Vout:19VDC, 4-pin DIN with lock, CCL, RoHS
19Z00-000630-00-RS Fan, +12V DC, 4-pin, 40 mm x 40 mm x10 mm, 6500RPM, RoHS
EMB-WIFI-KIT11-R20 1T1R wifi module kit for embedded system, IEEE802.11a/b/g/n/ac WiFi with Bluetooth 4.0/3.0+HS, 1 x wifi module, 2 x 400mm RF cable, 2 x Antenna,
RoHS
DK-75-R10 DIN mount kit adapter for VESA-75
TANK-870e-H110-WES7E64-R10 OS Image with Windows® Embedded Standard 7 E 64-bit for TANK-870e-H110 Series, with DVD-ROM, RoHS
TANK-870e-H110-W10E64-
H-R10 OS Image with Windows Embedded Standard 10 E High End 64-bit for TANK-870e-H110-i7 Series, with DVD-ROM, RoHS
TANK-870e-H110-W10E64-
V-R10 OS Image with Windows Embedded Standard 10 E Value 64-bit for TANK-870e-H110-i5 Series, with DVD-ROM, RoHS
Packing List
1 x Chassis Screw 1 x Mounting Bracket
TANK-870e-H110-2018-V14